Shielding Member Recesses for Adhesive Containment
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Solution Overview
Problem
Existing electronic devices face challenges in providing sufficient adhesive force between the circuit board and the shielding member without reducing the mounting area for electronic elements, often leading to separation issues under external impact and potential short circuits due to excessive solder usage.
Innovation Solution
The electronic device incorporates a shielding member with a sidewall that includes recesses for the adhesive material, allowing it to infiltrate and solidify within these recesses, thereby increasing the adhesive force while maintaining the mounting area for electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the amount of solder is increased to increase the adhesive force between the circuit board and the shielding member, then the adhesive force is improved, but the pad region is excessively widened and the area of the mounting region is decreased
Solution Approach 1:
The shielding member is designed with localized adhesive regions (protrusions or recesses) at specific positions where adhesive force is needed, rather than requiring uniform solder coverage across the entire pad region. This allows concentrated adhesive strength at critical points while maintaining adequate mounting region area.
Solution Approach 2:
The invention transitions from a two-dimensional solder pad coverage approach to a three-dimensional structure by adding protrusions or recesses on the shielding member that extend vertically. This dimensional change allows adhesive material to be contained and concentrated in specific volumes, improving adhesive force without requiring proportional increases in pad region area.
2Strength
If the amount of solder is increased to increase the adhesive force between the circuit board and the shielding member, then the adhesive force is improved, but the solder material may overflow into the mounting region to cause a short circuit
Solution Approach 1:
The shielding member incorporates recesses or cavities that act as containment structures for the adhesive material. These recesses provide a defined volume that holds the adhesive in place, preventing it from flowing or overflowing into the mounting region while still providing sufficient adhesive surface area for strong bonding.
Solution Approach 2:
The recesses in the shielding member serve as an intermediary structure between the adhesive material and the mounting region. They mediate the adhesive's position and flow characteristics, allowing the adhesive to maintain strong bonding force while being physically constrained from reaching areas where it could cause short circuits.
3Strength
If the pad region is widened to provide sufficient adhesive force, then the adhesive force is improved, but the area of the mounting region is decreased
Solution Approach 1:
The adhesive bonding function is segmented into discrete locations on the shielding member (such as multiple protrusions or recesses positioned at specific points). This segmentation allows the total adhesive force to be distributed across multiple concentrated points rather than requiring a large continuous pad region, thereby preserving mounting area while maintaining sufficient overall adhesive strength.
Data Source
AI summary
An electronic device is disclosed. The electronic device may comprise: a housing, a circuit board disposed inside the housing, a first electric element disposed on the circuit board, and a shielding member fixed to the circuit board by an adhesive material. The shielding member may have a shielding space formed therein and include a plate and a sidewall extending from a circumference of the plate towards the circuit board. The sidewall may include an inside surface facing the shielding space, an outside surface opposite to the inside surface, and a bottom surface facing the circuit board. The sidewall includes at least one protrusion extending toward the circuit board. The at least one protrusion may include at least one recess formed through the side wall on the bottom surface. At least part of the adhesive material may be received in the at least one recess.