Shielding Ring Deflector Plates Particle Prevention
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Solution Overview
Problem
In coating apparatuses, such as sputtering thin film equipment, target particles generated during the sputtering process do not adhere well to the chamber components and can float in the air, leading to contamination and backflow issues that affect film quality and increase maintenance time.
Innovation Solution
A particle prevention method and device that utilize a shielding ring with a specific geometry, including a first and second deflector plate, to guide air flow and remove floating target particles from the reaction chamber, preventing backflow and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If continuous pumping with working gas is used to remove floating particles, then particle removal efficiency is improved, but the air flow path becomes tortuous causing backflow and contaminating the reaction chamber
Solution Approach 1:
The shielding ring is divided into multiple functional components: a first shielding wall, a second shielding wall, a bottom shielding wall, and a cover ring. These segmented structures work together to create multiple airflow channels and shielding zones, preventing backflow while maintaining particle removal efficiency
Solution Approach 2:
The patent introduces an intermediary airflow guidance structure through the shielding ring components that mediate between the working gas flow and the reaction chamber. The shielding walls and cover ring create controlled airflow paths that prevent direct backflow contamination while allowing continuous particle removal
2Productivity
If the lower part of the reaction chamber is equipped with an exhaust port for continuous pumping, then floating carbon particles are removed, but target particles still settle on the wafer surface affecting film quality
Solution Approach 1:
The patent applies local quality by creating different shielding and airflow characteristics in different zones of the reaction chamber. The cover ring and shielding walls provide localized protection over the wafer area, creating a controlled environment that prevents particle settlement on the wafer surface while maintaining overall particle removal efficiency
3Quantity of substance
If carbon atoms are deposited on the cover ring, shielding ring, and shielding wall, then some particles are captured, but the carbon layers fall off due to poor adhesion requiring frequent cleaning
Solution Approach 1:
The patent extracts the problematic carbon deposition issue by designing a shielding ring structure that prevents carbon atoms from adhering to the chamber components in the first place. The optimized geometry and material selection create a surface that resists carbon adhesion, allowing particles to be captured and removed without forming persistent layers that require frequent cleaning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes target material particles from the reaction chamber, prevents particle contamination on the wafer, and reduces the deposition of target material in the equipment, thereby extending maintenance cycles and reducing maintenance time.
Implementation Method 1
the working gas, such as inert gas, is continuously introduced into the reaction zone 6a in the upper part of the reaction chamber 6, and then passes through the shielding ring 4 surrounding the holder plate 9 to the lower part of the reaction chamber 110, and is finally withdrawn by the exhaust port 7. The working gas is continuously pumped out by the vacuum pump 8 to drive the floating carbon particles out of the reaction chamber 6 by air flow.
Implementation Method 2
the lower part of the reaction chamber 6 is equipped with an exhaust port 7, which is connected to a vacuum pump 8 for continuous pumping
Data Source
AI summary
A particle prevention method in chamber includes providing a shielding ring, wherein the shielding ring includes a first side wall, a second side wall, and a bottom, the second side wall is parallel to the first side wall, and the bottom is connected to the first side wall, and the second side wall to form an annular groove area; connecting the first side wall to the reaction chamber with the first side wall extending toward an upper portion of a accommodating space of a reaction chamber; fixing a first deflector plate to the first side wall, wherein the first deflector plate extends obliquely toward the bottom, and the first deflector plate is located above the aperture; and fixing a second deflector plate to the second side wall, wherein the second deflector plate is located above the first deflector plate, and the second deflector plate extends obliquely toward the bottom.