Integrated Shielding Shed for Bus EMI Suppression
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Solution Overview
Problem
Electronic devices face significant challenges in suppressing electromagnetic interference (EMI) during high-speed signal transmission, which can lead to performance degradation or malfunctioning, necessitating improved electromagnetic compatibility (EMC).
Innovation Solution
An electronic device design incorporating an electromagnetic shielding structure and shed made of conductive materials like gold, silver, or copper, which covers the memory and bus, and is connected to a heat dissipating component, effectively clamping the bus to suppress EMI through a clamping mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding methods are used with multiple shielding clips, then EMI suppression is achieved, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent combines multiple separate shielding clips into a single integrated electromagnetic shielding shed that covers the bus. This unified structure maintains EMI suppression functionality while reducing the number of components and simplifying assembly operations, directly resolving the contradiction between effective shielding and assembly complexity
Solution Approach 2:
The electromagnetic shielding shed serves multiple functions simultaneously: it provides EMI shielding for the bus, acts as a structural support element, and facilitates heat dissipation through its connection to the heat dissipating component. This multi-functionality reduces the need for separate components, thereby simplifying device complexity while maintaining shielding effectiveness
2Reliability
If more shielding clips are used to suppress EMI, then electromagnetic compatibility improves, but manufacturing cost and assembly time increase
Solution Approach 1:
By merging multiple shielding clips into a single electromagnetic shielding shed, the patent reduces the number of assembly steps required. The unified structure can be installed as one piece rather than requiring multiple separate clip installations, thereby improving assembly efficiency while maintaining the same level of EMI suppression and electromagnetic compatibility
3Ease of manufacture
If the bus is not clamped, then assembly is simpler, but EMI suppression effectiveness decreases
Solution Approach 1:
The electromagnetic shielding shed integrates the clamping function into its overall structure, combining shielding and mechanical retention in one component. This eliminates the need for separate clamping mechanisms, maintaining assembly simplicity while ensuring the bus is properly clamped for effective EMI suppression
Solution Approach 2:
The shielding shed employs a shell structure that can flexibly adapt to the bus position and provide consistent clamping force. This flexible shell design achieves reliable bus retention and EMI suppression without requiring complex rigid clamping mechanisms, thereby maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces EMI field strength below CISPR 22 limits, enhancing EMC and cooling efficiency while simplifying assembly and reducing the need for excessive shielding clips.
Implementation Method 1
An electronic device design incorporating an electromagnetic shielding structure and shed made of conductive materials like gold, silver, or copper, which covers the memory and bus
Implementation Method 2
The heat dissipating component is staked on the processor
Data Source
AI summary
The disclosure provides an electronic device including an electronic assembly, a heat dissipating component, an electromagnetic shielding structure and an electromagnetic shielding shed. The electronic assembly includes a circuit board, a processor, a memory and a bus. The processor, the memory and the bus are stacked on the circuit board. The bus is located between and electrically connected to the processor and the memory. The heat dissipating component is staked on the processor. The electromagnetic shielding structure covers the memory. A side of the electromagnetic shielding shed is connected to the electromagnetic shielding structure, another side of the electromagnetic shielding shed is connected to the heat dissipating component, and the electromagnetic shielding shed covers at least part of the bus.