Shielding Sheet and Heat Sink Structure for EMI and Cooling
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Solution Overview
Problem
Existing portable communication devices face a trade-off between electromagnetic interference shielding and heat dissipation, as opening the shield can for heat dissipation reduces shielding effectiveness, and closing it with a shielding film compromises heat dissipation performance.
Innovation Solution
A shielding and heat dissipation structure is implemented with a shield can, a shielding sheet, and a heat dissipation member, where the shielding sheet includes a first part contacting the shield can and defines a second cavity with a greater width than the first cavity, and an elastic member provides elastic force to maintain electrical and thermal connections, enhancing both shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the shield can cover is opened for heat dissipation, then heat dissipation performance is improved, but shielding effectiveness is reduced
Solution Approach 1:
The shield can cover is divided into a first cover portion and a second cover portion that can move relative to each other. The first cover portion maintains shielding effectiveness while the second cover portion provides heat dissipation pathways, allowing both functions to coexist without compromising either.
Solution Approach 2:
The shield can cover transitions from a static closed structure to a dynamic movable structure. The second cover portion can move between positioned and unpositioned states, enabling the system to adapt between shielding mode and heat dissipation mode as needed.
2Object-affected harmful factors
If a shielding film is used to close the shield can cover, then shielding effectiveness is maintained, but heat dissipation performance is compromised
Solution Approach 1:
The shield can cover is segmented into functional portions: the first cover portion provides shielding continuity while the second cover portion creates controlled openings for heat dissipation. This segmentation eliminates the need for shielding films that would block heat pathways.
Solution Approach 2:
Different portions of the shield can cover have different properties: the first cover portion is designed for electromagnetic shielding, while the second cover portion is designed for heat dissipation. This local differentiation allows each region to optimize its specific function without compromising the other.
3Temperature
If the shielding sheet defines a second cavity with greater width, then heat dissipation space is increased, but device complexity increases
Solution Approach 1:
The second cavity is integrated into the existing shield can structure rather than being a separate component. The shielding sheet is positioned within the shield can to form the cavity, merging heat dissipation functionality with the shielding structure and avoiding additional complexity.
Solution Approach 2:
The shield can structure serves multiple functions: electromagnetic shielding through the conductive material and heat dissipation through the second cavity. This multi-functionality reduces the need for separate dedicated heat dissipation components, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves improved electromagnetic interference shielding and heat dissipation by maintaining electrical and thermal connections, reducing contact resistance and mechanical tolerances, thereby enhancing overall performance.
Implementation Method 1
an elastic member 260 that is disposed between the first part 211 and 221 of the shielding sheet 200 and the heat dissipation member 270, 570, 670, 770, 870, 970, 1070, and 1170 in the second cavity 20, and provides an elastic force to the first part 211 and 221
Implementation Method 2
a thermal interface material (TIM) 240 that is disposed between the heat dissipation member 270, 570, 670, 770, 870, 970, 1070, and 1170 and the electronic component 230
Implementation Method 3
the shield can 250, the shielding sheet 200, and the heat dissipation member 270, 570, 670, 770, 870, 970, 1070, and 1170 may be electrically connected to each other
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
Disclosed is an electronic device. The electronic device includes: a shield can including a first cavity and a first opening to communicate with the first cavity; an electronic component disposed in the first cavity; a shielding sheet disposed at an upper portion of the shield can, communicating with the first cavity , and defining a second cavity, the shielding sheet including a first part contacting the shield can; a heat-dissipation member disposed on the shielding sheet to close the second cavity; and a thermal interface material (TIM) disposed between the heat-dissipation member and the electronic component. The shield can, the shielding sheet, and the heat-dissipation member are electrically connected to each other, the electronic component, the TIM, and the heat-dissipation member are thermally connected to each other, the first cavity has a first width, and the second cavity has a second width, greater than the first width.