Integrated Shielding Sheet for Heat Dissipation and EMI Shielding
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Solution Overview
Problem
Conventional heat radiating structures face challenges in effectively shielding electromagnetic waves and managing heat dissipation in electronic devices, particularly due to limitations in EMI shielding, insulation, and thickness, which complicates the direct attachment of heat radiating members to electric components like application processors.
Innovation Solution
The proposed solution involves an electronic device design with a shielding sheet having a flexible structure and an integral heat transfer member, featuring a designated inclined or curved surface, which is pre-formed using a silicone compressing jig and integrated with a heat radiating member and cooling sheet to efficiently transfer heat and shield electromagnetic waves, eliminating the need for a support layer like a copper plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a support layer (e.g., copper plate) is used for mass production, then manufacturing ease is improved, but device complexity and shielding performance are reduced
Solution Approach 1:
The patent merges the support layer, shielding sheet, and heat transfer member into a single integrated structure. The shielding sheet serves simultaneously as structural support, EMI shielding, and heat transfer pathway, eliminating the need for separate copper plate support layers and reducing overall device complexity while maintaining mass production capability
Solution Approach 2:
The shielding sheet is designed to perform multiple functions: providing structural support, blocking electromagnetic waves, and transferring heat from electronic components. This multi-functional design replaces the traditional separate support layer and heat sink assembly, simplifying the overall structure while improving shielding performance
2Strength
If a support layer is used, then structural integrity is improved, but heat transfer efficiency and shielding performance are reduced
Solution Approach 1:
The shielding sheet is constructed from composite materials that combine high mechanical strength with superior EMI shielding properties and thermal conductivity. This allows the single layer to simultaneously provide structural integrity, block electromagnetic waves effectively, and transfer heat efficiently without requiring additional support layers
3Temperature
If conventional heat radiating structures are used, then heat dissipation is achieved, but EMI shielding performance and structural thickness are compromised
Solution Approach 1:
The patent combines the EMI shielding function and heat transfer function into a single integrated shielding sheet structure. The shielding sheet directly contacts electronic components to transfer heat while simultaneously blocking electromagnetic waves, eliminating the need for separate heat radiating structures that would compromise shielding performance or increase device thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency, reduces the overall thickness of the heat radiating structure, and improves EMI shielding performance, allowing for effective heat dissipation and electromagnetic wave shielding without compromising the structural integrity or thickness.
Implementation Method 1
a heat transfer member disposed in contact between the at least one electric component and the shielding sheet
Implementation Method 2
a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening
Data Source
AI summary
An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.