Shielding Sheet Heat Dissipation Member Electronic Device

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Solution Overview

Problem

Existing shielding structures for electronic devices are ineffective in efficiently dissipating heat generated by electronic components, leading to potential malfunctions due to inadequate heat discharge.

Innovation Solution

A shielding structure comprising a shielding sheet with an adhesive layer, an insulating layer, and a conductive layer, along with a thermal interface material and a heat dissipation member, is used to cover electronic components. The conductive layer is in direct contact with the components and the thermal interface material, and the heat dissipation member is fastened to the circuit board, allowing for effective heat transfer and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shield can made of metal material is used to block electromagnetic waves, then electromagnetic wave blocking is improved, but heat dissipation performance deteriorates

Engineering Contradiction:

Improveelectromagnetic wave blockingVSAvoidheat dissipation performance

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The invention divides the shielding structure into multiple functional layers: a shielding sheet with conductive and insulating layers for electromagnetic wave blocking, and a separate heat dissipation member for thermal management. This segmentation allows each layer to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shielding sheet combines multiple materials with different properties: a conductive layer (such as metal foil) for electromagnetic shielding, an insulating layer for electrical isolation, and an adhesive layer for bonding. This composite structure enables simultaneous achievement of electromagnetic wave blocking and heat dissipation functions.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If a traditional shield can structure is used, then electromagnetic shielding is achieved, but heat transfer efficiency deteriorates

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidheat transfer efficiency

Core Design Contradiction:

Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The thermal interface material serves as an intermediary between the electronic component and the heat dissipation member, facilitating efficient heat transfer. This intermediary material fills gaps and improves thermal contact, thereby enhancing heat transfer efficiency while maintaining the electromagnetic shielding function of the shielding sheet.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat dissipation member is designed to perform multiple functions: it dissipates heat from the electronic component, provides mechanical support, and works in conjunction with the shielding sheet to achieve both electromagnetic shielding and thermal management in a single integrated structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively blocks electromagnetic interference and quickly dissipates heat from electronic components, enhancing the stability and performance of electronic devices by ensuring efficient heat management.

Implementation Method 1

The conductive layer is in direct contact with the components and the thermal interface material, and the heat dissipation member is fastened to the circuit board, allowing for effective heat transfer and dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a heat dissipation member, is used to cover electronic components... allowing for effective heat transfer and dissipation

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP3959952B1Electronic device including a shielding sheet and a heat radiation member

Publication Date: 2024.10.16 SAMSUNG ELECTRONICS CO LTD

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Figure 2A~2B
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AI summary

An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.