Shielding Structure With Integrated Conductive Trace For Stacked PCB Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current shielding structures for electronic components on printed circuit boards (PCBs) are inefficient in utilizing space, as they are designed for horizontal arrangements, limiting the ability to stack components and provide adequate shielding and control functionality.
Innovation Solution
A shielding structure comprising a metal housing, a plastic member, and a conductive trace, where the plastic member is disposed between the metal housing and the conductive trace, allowing for vertical stacking of components and enhanced space utilization by integrating circuitry within the shielding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are arranged horizontally on a PCB with conventional shielding covers, then shielding effect is provided, but space utilization rate is low
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of electronic components. The shielding structure is designed to cover vertically stacked components rather than horizontally arranged ones, utilizing the third dimension (height) to increase space utilization while maintaining shielding effectiveness through the metal housing and conductive trace configuration.
Solution Approach 2:
The patent combines multiple functions into a single shielding structure: electromagnetic shielding, circuit control, and component mounting support. The conductive trace is integrated directly into the shielding structure, merging the shielding cover and control circuit into one unified component, thereby reducing the number of separate elements and improving space efficiency.
2Adaptability or versatility
If additional control functionality is added to electronic components, then control requirement is met, but space on PCB is occupied
Solution Approach 1:
The control circuit is integrated within the shielding structure itself through the conductive trace formed on the plastic member. This merging of the shielding function and control circuit function allows the structure to provide both electromagnetic shielding and control functionality for stacked components without requiring additional PCB space.
Solution Approach 2:
The shielding structure is designed to perform multiple functions simultaneously: providing electromagnetic shielding, offering mechanical support for vertically stacked components, and delivering control functionality through the integrated conductive trace. This multi-functionality eliminates the need for separate components and reduces overall space requirements.
3Area of stationary object
If multiple electronic components are stacked on PCB, then space utilization rate is enhanced, but shielding and control functionality must be maintained
Solution Approach 1:
The patent merges the shielding structure with the control circuit by forming the conductive trace directly on the plastic member within the shielding housing. This integration allows the same structure to provide both shielding and control functions, simplifying the overall device complexity while supporting vertically stacked components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient space utilization on PCBs by providing both shielding and control functionality for stacked electronic components, enhancing the overall space utilization rate while maintaining the necessary shielding effect.
Implementation Method 1
forming the aforementioned plastic member by injection molding a plastic material into the metal housing, in which a connecting surface of the plastic member is attached to an inner surface of the metal housing
Implementation Method 2
forming the aforementioned conductive trace by chemical plating the exposed surface of the plastic member
Data Source
AI summary
A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.