Shielding Wire Support Structure for Compact EMI-Shielded Packages
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Solution Overview
Problem
Semiconductor devices emit electromagnetic interference (EMI) during operation, which can affect neighboring components, and traditional shielding methods, such as using wires or shielding layers, increase the device size.
Innovation Solution
A semiconductor device design featuring a shielding wire across the semiconductor die and an auxiliary structure to support the shielding wire, reducing the distance between components and effectively shielding EMI while minimizing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wires or shielding layers are used to shield electromagnetic interference, then electromagnetic interference is reduced, but the size of the semiconductor device increases
Solution Approach 1:
The patent introduces an auxiliary structure that creates a three-dimensional configuration with the conductive wire, forming an attachment angle greater than 45 degrees. This vertical dimensionality change allows the shielding wire to be positioned closer to the semiconductor die while maintaining EMI shielding effectiveness, thereby reducing the overall device footprint without compromising shielding performance.
Solution Approach 2:
The patent changes the geometric parameters of the shielding structure by defining a specific attachment angle (greater than 45 degrees) between the conductive wire and the substrate. This parameter optimization enables more efficient EMI shielding with reduced material usage and smaller device dimensions, as the steeper angle allows better spatial utilization of the shielding wire.
2Area of stationary object
If the distance between semiconductor die and circuit device is reduced, then device size is reduced, but electromagnetic interference shielding becomes more difficult
Solution Approach 1:
By creating a vertical component through the auxiliary structure and achieving an attachment angle greater than 45 degrees, the patent enables the shielding wire to effectively cover the semiconductor die even when horizontal spacing is minimized. This three-dimensional shielding approach maintains EMI protection while allowing tighter integration and smaller device size.
Solution Approach 2:
The auxiliary structure serves as an intermediary element that connects the conductive wire to the substrate at an optimized angle. This intermediary structure enables the shielding wire to achieve better spatial positioning and coverage, effectively shielding the semiconductor die even when the distance to circuit devices is reduced.
3Area of stationary object
If a steeper attachment angle is achieved for the conductive wire, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The auxiliary structure acts as a manufacturing-friendly intermediary that facilitates achieving the desired steep attachment angle. By providing a structured support element, it simplifies the wire bonding process compared to attempting to achieve steep angles through complex bonding tooling or multi-step procedures, thereby reducing manufacturing complexity while maintaining the space-saving angular configuration.
Data Source
AI summary
A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.