Shift Camera Sensor Heat Dissipation Using a Passive Exchanger

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Solution Overview

Problem

Small form factor cameras in portable devices face challenges in dissipating heat effectively due to the movement of the image sensor assembly, which is suspended above the enclosure, leading to potential overheating and reduced reliability.

Innovation Solution

A passive heat exchanger is integrated into the camera module, utilizing a conductive pathway through thermally conductive materials like gels or heat sinks to dissipate heat from the image sensor, reducing the peak sensor temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the image sensor assembly is suspended above the enclosure to enable movement for autofocus and optical image stabilization, then the camera can achieve small form factor and mobility, but heat dissipation becomes difficult leading to overheating

Engineering Contradiction:

Improvesensor movement capabilityVSAvoidsensor temperature

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

A flexible thermal interface material is introduced as an intermediary between the image sensor and the enclosure bottom wall. This material maintains thermal contact during sensor movement while accommodating the floating architecture, enabling heat transfer from the moving sensor to the stationary enclosure structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conduction path extends into the vertical dimension by using the enclosure bottom wall as a heat sink surface. The flexible thermal interface material bridges the gap between the sensor bottom surface and the enclosure interior surface, creating a three-dimensional thermal management solution.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If a conductive pathway is established from the moving image sensor to the enclosure, then heat dissipation improves, but the sensor assembly becomes more complex

Engineering Contradiction:

Improveheat dissipationVSAvoidsensor assembly structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The flexible thermal interface material serves multiple functions simultaneously: it provides thermal conduction, accommodates sensor movement, and maintains mechanical contact. This consolidation of thermal and mechanical functions into a single component reduces overall system complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The flexible thermal interface material is designed to perform multiple roles: thermal conduction, mechanical cushioning, and movement accommodation. This multi-functional approach eliminates the need for separate components for each function, simplifying the sensor assembly structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If the image sensor is made small for portable devices, then the device form factor is reduced, but heat dissipation capability is diminished

Engineering Contradiction:

Improvecamera sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat dissipation function is extracted from the sensor assembly itself and transferred to the enclosure structure. By using the enclosure bottom wall as a heat sink and the flexible thermal interface material as a thermal conduit, the limited space within the compact sensor assembly is overcome by utilizing the larger enclosure structure for thermal management.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The passive heat exchanger enhances heat dissipation, maintaining the sensor temperature below 70 degrees Celsius, thereby improving camera reliability and reducing the risk of overheating.

Implementation Method 1

a passive heat exchanger thermally coupled to the image sensor to dissipate heat away from the image sensor... a thermally conductive gel contacting the image sensor and the conductive stiffener plate to form a conductive pathway that dissipates the heat away from the image sensor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a passive heat exchanger includes a heat sink directly attached to a bottom side of the image sensor... a passive heat exchanger includes a heat sink attached to an interior side of the camera enclosure

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a passive heat exchanger includes a number of heat sink fins formed in a portion of the conductive stiffener plate directly below the image sensor

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12389094B2Sensor temperature reducer for a sensor shift camera architecture

Publication Date: 2025.08.12 APPLE INC

AI summary

A camera comprising: a camera enclosure; an optomechanical assembly fixedly coupled to the camera enclosure; an image sensor assembly movably coupled to the camera enclosure, the image sensor assembly comprising: a substrate, an image sensor coupled to the substrate, a flexible printed circuit board coupled to the substrate, a conductive stiffener plate coupled to the flexible printed circuit board, and a passive heat exchanger thermally coupled to the image sensor to dissipate heat away from the image sensor.