Shim-Based Interconnects for Compact Electronic Component Placement
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Solution Overview
Problem
In surface mount technology, solder spots on electronic components spread beyond their edges, requiring significant spacing between connections to avoid short-circuits, which limits the density of component placement on support substrates.
Innovation Solution
An electronic device with a support substrate and an electronic component connected via electrically conducting shims and coatings, where the shims are made of metal materials with higher melting temperatures than the coatings, allowing for localized and controlled connections without spreading, using a method involving shim placement, brazing paste deposition, and hardening to form conductive coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder spots are used to connect electronic components to support substrates, then electrical connection is achieved, but the solder spots spread beyond component edges requiring large spacing between connections
Solution Approach 1:
The patent introduces a shim as an intermediary element between the electronic component and support substrate. The shim is a thin metallic sheet with a defined connection area that is smaller than the component edges. The shim serves as a mediator that provides reliable electrical connection through controlled soldering while limiting the spread of solder material, thus resolving the contradiction between connection reliability and surface area occupation.
Solution Approach 2:
The patent changes the physical parameters of the connection structure by using a shim with specific dimensional parameters (thickness, connection area) that are optimized to prevent solder spread. By controlling the shim's parameters, the connection achieves both electrical reliability and compact footprint, allowing closer placement of neighboring components.
2Reliability
If large spacing is maintained between connection spots to avoid short-circuits, then short-circuit risk is reduced, but component placement density decreases
Solution Approach 1:
The shim acts as a mediator that defines precise connection boundaries, enabling reliable short-circuit prevention with minimal spacing. The shim's controlled connection area ensures solder material does not spread beyond designated regions, allowing neighboring components to be placed closer together while maintaining electrical safety.
Solution Approach 2:
The patent applies local quality by creating a concentrated connection zone through the shim, where electrical connection properties are optimized locally. The shim provides high-quality electrical connection in a localized area while maintaining isolation from adjacent connections, enabling higher component density without increasing short-circuit risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and compact connections between electronic components and substrates, allowing for closer placement of neighboring components without the risk of short-circuits, thereby improving the surface utilization and assembly efficiency.
Implementation Method 1
The coating can comprise a hardened brazing material
Implementation Method 2
The shims can have a melting temperature higher than the melting temperature of the coatings
Data Source
AI summary
A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.