Shingled Solar Cell Module With Hidden Tap Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solar cell modules face inefficiencies in heat management and hot spot formation due to the lack of effective heat conduction and parallel bypass diodes, which can lead to reduced performance and reliability.
Innovation Solution
The implementation of shingled solar cell modules with overlapping and conductively bonded silicon solar cells, using a conductive adhesive to facilitate series connections and enhance heat conduction, and the use of flexible electrical interconnects to accommodate thermal expansion and improve module robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solar cells are connected using traditional rigid interconnects, then electrical connection is achieved, but thermal expansion mismatch causes stress and reliability issues
Solution Approach 1:
The patent employs flexible thin-film interconnects with metallic traces that can bend and stretch to accommodate thermal expansion differences between solar cells and encapsulant materials. This flexibility prevents stress concentration and delamination while maintaining electrical connectivity throughout the module's operational lifetime.
Solution Approach 2:
The interconnect structure combines multiple materials including metallic conductive traces, flexible polymer substrates, and adhesive layers to create a composite interconnect that simultaneously provides electrical conductivity, mechanical flexibility, and strong bonding to different substrates.
2Reliability
If heat conduction pathways are not optimized, then manufacturing is simpler, but hot spots form and reduce performance
Solution Approach 1:
The patent divides the heat conduction function into multiple parallel pathways by incorporating heat dissipation features at regular intervals across the module, including thermally conductive elements in the encapsulant and frame structures that create a distributed heat sink network to prevent localized hot spot formation.
Solution Approach 2:
The patent introduces thermally conductive intermediary materials and structures between the solar cells and the module frame, acting as heat transfer mediators that efficiently conduct heat away from the cells without requiring direct metal-to-cell contact, thus preventing hot spots while maintaining manufacturing simplicity.
3Reliability
If parallel bypass diodes are not included, then device complexity is reduced, but hot spots cannot be prevented
Solution Approach 1:
The patent combines the bypass diode function with the existing series string interconnect structure by integrating bypass pathways into the same interconnect layers that provide series connections, eliminating the need for separate bypass diode components and reducing overall device complexity while maintaining hot spot prevention capability.
4Productivity
If shingled overlapping configuration is used, then active area utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment features such as registration marks, mechanical guides, and pre-positioned interconnect elements during the cell assembly process that automatically guide the overlapping cells into correct positions, eliminating the need for high-precision manual alignment and enabling efficient shingled module manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents hot spots, enhances thermal damage resistance, and improves the reliability and efficiency of solar cell modules by ensuring effective heat management and flexible electrical connections.
Implementation Method 1
using a conductive adhesive to facilitate series connections and enhance heat conduction
Implementation Method 2
the use of flexible electrical interconnects to accommodate thermal expansion
Data Source
AI summary
A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.