Shingled Solar Cell Module Layout for Hot Spot Mitigation

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Solution Overview

Problem

Existing solar cell modules face challenges in achieving high efficiency and reliability due to issues such as hot spots in reverse biased cells and inadequate heat conduction, which can lead to thermal damage and reduced performance.

Innovation Solution

The solar cells are arranged in a shingled manner with overlapping and conductively bonded long sides, using conductive adhesives for series connection, and encapsulated in a thermoplastic olefin polymer between glass sheets, enhancing heat conduction and preventing hot spots. Flexible and rigid conductive bonds accommodate thermal expansion, and hidden tap contact pads provide additional electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional solar cell modules are used with traditional bonding methods, then manufacturing is simpler, but heat management is ineffective leading to hot spots and reduced reliability

Engineering Contradiction:

Improvemodule reliabilityVSAvoidmodule structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The solar cell module is divided into multiple solar cells arranged in a shingled configuration, where each cell is independently bonded to adjacent cells using conductive adhesive. This segmentation allows for better heat dissipation at each cell level while maintaining overall module reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The module employs a composite structure combining solar cells, conductive adhesive material, and encapsulant in a shingled arrangement. This composite design improves heat conduction pathways while managing the complexity through integrated material selection.

Inventive Principle:

Principle #40Composite materials

2Temperature

If solar cells are arranged in shingled configuration with conductive adhesive bonding, then heat conduction is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipationVSAvoidcell alignment precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The shingled arrangement allows for thermal expansion and contraction dynamics to be accommodated through the overlapping cell configuration and flexible conductive adhesive bonding, reducing stress while maintaining heat conduction pathways.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The conductive adhesive material serves as an intermediary between adjacent solar cells, providing both mechanical bonding and thermal conduction. This intermediary layer compensates for minor alignment variations while maintaining effective heat transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If bypass diodes are reduced in number, then device complexity is reduced, but hot spot prevention capability is compromised

Engineering Contradiction:

Improvebypass diode quantityVSAvoidhot spot formation

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the electrical protection mechanism (bypass diodes) with a thermal management mechanism (conductive adhesive bonding and shingled arrangement). The improved heat conduction physically prevents hot spot formation by distributing thermal energy, substituting thermal management for electrical protection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If solar cells are conductively bonded with overlapping arrangement, then electrical connection is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidassembly ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the electrical connection function and mechanical bonding function into a single conductive adhesive bonding step. The conductive adhesive simultaneously provides electrical conductivity and mechanical attachment, eliminating separate wiring and bonding operations.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This arrangement facilitates safe and efficient operation by preventing hot spots, improving thermal management, and enabling high voltage output without damage, thus enhancing the reliability and efficiency of the solar module.

Implementation Method 1

using conductive adhesives for bonding, and encapsulated in thermoplastic olefin between glass sheets to enhance heat conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12615878B2Shingled solar cell module

Publication Date: 2026.04.28 MAXEON SOLAR PTE LTD

AI summary

A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.