Shock-Absorbing Electronic Assembly for Medical Imaging Heat Management
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Solution Overview
Problem
Portable medical imaging devices face challenges in simultaneously isolating x-ray detector arrays from mechanical shock and thermally managing heat generated by components, as existing thermal compounds are not shear-resistant and fail under shear forces, leading to potential breakage and inefficient heat dissipation.
Innovation Solution
The solution involves an electronic assembly with a shock-absorbing material coupling the assembly to a casing, and a heat-conducting material between the circuit board and an isolated member to absorb shocks and conduct heat away, using materials like graphite for the casing and non-conductive heat conducting compounds to prevent shearing, while allowing relative movement to reduce acceleration and absorb shocks in multiple directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal compound is used to thermally couple heat generating components to the casing, then heat conduction is improved, but the thermal compound is not shear resistant and fails when shear forces are applied during shock events
Solution Approach 1:
The patent introduces a shock-absorbing material as an intermediary between the electronic assembly and the casing. This shock-absorbing material acts as a mediator that decouples the shear forces from the thermal compound, allowing the thermal compound to maintain its thermal coupling function without experiencing shear stresses that would cause failure.
Solution Approach 2:
The patent segments the coupling function into two separate materials: one material (thermal compound) dedicated to heat conduction and another material (shock-absorbing material) dedicated to mechanical shock absorption. This segmentation allows each material to optimize its specific function without compromising the other.
2Stability of the object's composition
If the detector array is rigidly fixed to the casing, then structural stability is improved, but the detector array is vulnerable to breakage during shock events
Solution Approach 1:
The patent applies beforehand cushioning by placing shock-absorbing material between the electronic assembly and the casing before shock events occur. This pre-positioned cushioning material absorbs and attenuates shock forces, protecting the detector array from breakage while maintaining structural stability during normal operation.
3Object-affected harmful factors
If the detector array is allowed to move relative to the casing to absorb shock, then shock protection is improved, but heat conduction path may be compromised
Solution Approach 1:
The patent segments the functional requirements by using separate materials for shock absorption and heat conduction. The shock-absorbing material handles mechanical movement and shock attenuation, while the thermal compound maintains the thermal conduction path, allowing both functions to coexist without compromising each other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the transmission of shearing forces to thermal compounds, efficiently conducts heat away from heat-generating components, and provides enhanced protection against mechanical shocks, ensuring reliable operation and reduced weight of the detector array.
Implementation Method 1
a heat conducting material coupled between the circuit board and the at least one isolated member configured to conduct heat away from the circuit board to the at least one isolated member
Implementation Method 2
a shock absorbing material flexibly coupling the electronic assembly directly or indirectly to the at least one isolated member
Implementation Method 3
shock absorbing material flexibly coupling the electronic assembly
Data Source
AI summary
An apparatus is provided that includes an electronic assembly having a panel and a circuit board, a casing surrounding the electronic assembly and at least one isolated member coupled to the casing. The apparatus further includes a shock absorbing material flexibly coupling the electronic assembly directly or indirectly to the at least one isolated member.