Shock-Absorbing Resin Composition for Thin-Film Damping
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Solution Overview
Problem
Conventional high molecular-weight compound-based damping materials require a thickness of several millimeters to exhibit sufficient damping performance, making them unsuitable for further miniaturization and weight reduction of devices.
Innovation Solution
A shock absorption-resin composition comprising a block copolymer with a hard segment and a soft segment, combined with a filler and a liquid polyol-based component, which enhances damping performance even when the composition is thinned.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high molecular-weight compound-based damping materials are used, then damping performance can be achieved, but the thickness must be at least several millimeters which prevents further miniaturization and weight reduction of devices
Solution Approach 1:
The patent changes the physical and chemical parameters of the damping material by using a block copolymer with specifically controlled glass transition temperatures for hard and soft segments. This molecular-level parameter change enables superior damping performance at reduced thickness compared to conventional high molecular-weight compounds
Solution Approach 2:
The patent creates a composite shock absorption-resin composition by blending the block copolymer with a liquid polyol-based component. This composite formulation achieves enhanced damping performance and flexibility, allowing thinner designs while maintaining or improving shock absorbability
2Reliability
If conventional high molecular-weight compound-based damping materials are used, then damping performance can be achieved, but the thickness must be at least several millimeters which prevents further miniaturization of devices
Solution Approach 1:
The patent modifies the viscoelastic parameters of the damping material through block copolymer design with specific glass transition temperatures. This enables the material to achieve optimal damping performance at reduced thickness, directly addressing the volume reduction requirement for miniaturized devices
Solution Approach 2:
The patent develops a thin-film shock absorption-resin composition that maintains superior damping performance despite reduced thickness. The flexible nature of the block copolymer-based material allows it to function effectively as a thin protective layer, enabling device miniaturization
3Weight of stationary object
If the thickness of damping materials is reduced below several millimeters, then weight and size are reduced, but sufficient damping performance cannot be exhibited
Solution Approach 1:
The patent fundamentally changes the material parameters by using a block copolymer with dual glass transition temperatures (hard segment Tg ≥ 30°C, soft segment Tg ≤ 0°C). This parameter change enables the material to exhibit sufficient damping performance even when thinned to reduced thicknesses, reversing the conventional thickness-performance relationship
Solution Approach 2:
The patent successfully develops a thin-film formulation that maintains superior damping performance. The block copolymer-based resin composition achieves this by leveraging the viscoelastic properties of the soft segment while the hard segment provides structural integrity, allowing effective damping in thin configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior shock absorbability and damping performance at reduced thickness, making it suitable for smaller and lighter devices.
Implementation Method 1
damping materials that can be expected to have high damping performance and reduced production cost have been studied. Damping materials are known that convert vibration energy into thermal energy and utilize viscoelasticity of a high molecular-weight compound.
Data Source
AI summary
There is provided a shock absorption-resin composition comprising: an A component comprising one or more block copolymers each comprising a polymer component A1 having a glass transition point of 30° C. or higher and a polymer component A2 having a glass transition point of 0° C. or lower; a B component comprising a polymer compatible with the polymer component A1; a C component comprising a filler compatible with the B component or dispersible in the B component; and a D component comprising a liquid polyol-based component.