Shock-Tolerant Electronics Package for Downhole Heat Dissipation
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Solution Overview
Problem
Existing electronics packaging for downhole applications in high-temperature and high-shock environments, such as well drilling, is inadequate due to conflicting techniques for mitigating heat and shock damage, leading to unreliable and costly explosive setting methods.
Innovation Solution
A shock-tolerant heat dissipating electronics package with multiple chassis featuring inclined surfaces that radially expand upon activation, forming a near-monolithic structure for enhanced thermal contact and shock resistance, eliminating secondary shock and maintaining effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation techniques (heat sink with spring compression) are used, then heat dissipation is improved, but shock tolerance deteriorates due to amplified secondary shocks
Solution Approach 1:
The electronics package is divided into multiple separate chassis (first chassis, second chassis, etc.) that can move independently within the housing. Each chassis contains electronics components and can be independently positioned and damped, allowing heat dissipation structures to be optimized for each segment without compromising overall shock tolerance.
Solution Approach 2:
Shock-absorbing elements are pre-installed between the electronics chassis and the housing to cushion against shocks before they reach the electronics. These elements are positioned in advance to absorb the full force of anticipated shocks, preventing secondary shock amplification that would occur with rigid heat dissipation structures.
2Reliability
If electronics are tightly accommodated to enhance shock tolerance, then shock tolerance is improved, but heat dissipation deteriorates due to compromised thermal contact
Solution Approach 1:
Different regions of the electronics package have different structural properties. The areas requiring shock tolerance have cushioning elements and flexible mounting, while the areas requiring heat dissipation have direct thermal contact between the heat sink and electronics components. This localized differentiation allows each function to be optimized independently.
Solution Approach 2:
The package is segmented into multiple chassis where each can be independently mounted with appropriate shock absorption. Heat dissipation structures are integrated into specific chassis segments, allowing thermal contact to be maintained locally without requiring the entire structure to be rigid.
3Ease of operation
If explosives are used for setting application, then setting capability is achieved, but control and monitoring capability are lost
Solution Approach 1:
The patent replaces explosive mechanical setting mechanisms with an electric motor-driven system. The motor drive unit can be precisely controlled through electronics to expand the bridge plug radially, providing intelligent control and monitoring capabilities while achieving the same setting function. This substitution enables digital signal processing and real-time data collection during the setting operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, controlled, and intelligent deployment of bridge plugs and other well isolation mechanisms, reducing the risk of heat and shock damage, allowing for cost-effective use of sophisticated electronics in extreme conditions.
Implementation Method 1
An activation force mechanism may be disposed in the channel adjacent one of the chassis. The mechanism may be configured for axially directing this chassis toward the other such that radial expansion of the chassis toward the housing takes place via interfacing of the inclined surfaces
Data Source
AI summary
An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.