Semiconductor Module Short-Side Terminals for Compact Relay Circuits
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Solution Overview
Problem
In electric driving devices with redundant power conversion circuits, it is challenging to efficiently utilize the mounting area on a substrate due to the spatial constraints imposed by the arrangement of high and low potential side MOSFETs and phase relay MOSFETs, making it difficult to integrate additional elements like current detection components.
Innovation Solution
A semiconductor module with a switching element, sealing portion, drain terminal, source terminal, and gate terminal is designed, where the terminals are exposed on the short sides of a rectangular sealing portion, allowing for effective use of substrate space by reducing the size of the motor relay module and enabling the integration of peripheral components like shunt resistors and snubber circuit elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high and low potential side MOSFETs and phase relay MOSFETs are arranged adjacently to achieve power conversion circuit integration, then the power conversion function is realized, but the mounting area on the substrate is insufficient for integrating additional elements like current detection components
Solution Approach 1:
The patent transitions from a planar 2D arrangement of power conversion components to a 3D stacked configuration. The motor relay module is positioned above the substrate surface, utilizing the vertical dimension to accommodate additional elements like shunt resistors and snubber circuit elements in the same footprint area, thereby increasing integration capability without consuming additional substrate area.
Solution Approach 2:
The patent implements nesting by placing the shunt resistor and snubber circuit element inside or adjacent to the motor relay module structure. The shunt resistor is positioned to utilize the space within the motor relay module's footprint, while the snubber circuit element is integrated into the same vertical column, creating a nested arrangement that maximizes space utilization.
2Area of stationary object
If the motor relay module size is reduced to optimize substrate area usage, then more components can be mounted, but heat dissipation efficiency may be compromised
Solution Approach 1:
The patent extends the heat dissipation structure into the vertical dimension by providing a heat sink that protrudes from the substrate surface. The heat sink is positioned to receive heat from the motor relay module and dissipate it vertically, decoupling the heat dissipation volume from the substrate footprint and maintaining thermal efficiency in a compact planar configuration.
Solution Approach 2:
The patent introduces a dedicated heat sink as an intermediary thermal management component. The heat sink acts as a thermal mediator between the motor relay module and the ambient environment, efficiently transferring heat away from the compact module structure and preventing thermal accumulation despite the reduced module size.
3Area of stationary object
If terminals are exposed on the short sides of the sealing portion, then substrate space is optimized, but terminal accessibility for connection may be affected
Solution Approach 1:
The patent positions the terminals on the vertical sidewalls of the sealing portion rather than on the top surface. This vertical arrangement allows terminals to be accessible from the side direction, maintaining ease of connection while utilizing the vertical dimension to preserve substrate surface area for other component placements.
Data Source
AI summary
A semiconductor module includes a switching element, a sealing portion, a drain terminal, a source terminal, and a gate terminal. The drain terminal is connected to a drain of the switching element. The source terminal is connected to a source of the switching element. The gate terminal is connected to a gate of the switching element. The sealing portion has a rectangular shape in a plan view, and molds the switching element. Each of the drain terminal, the source terminal, and the gate terminal is exposed from the sealing portion on a short side of the rectangle.