Shorted Surface Mount Passive Component for EMI Shielding and Heat Dissipation
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Solution Overview
Problem
There is a need for cost-effective design structures in smaller devices to address issues such as electromagnetic interference, heat dissipation, and effective inductance tuning, which existing surface mount technology has not adequately resolved.
Innovation Solution
A device comprising a substrate with multiple metal and dielectric layers, where a surface mount passive component is shorted by coupling its terminals to ground signals, allowing it to function as an electromagnetic shield, heat sink, or inductor tuner, providing a low-cost solution for these challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If surface mount passive components are used in smaller devices, then device miniaturization is achieved, but electromagnetic interference and heat dissipation problems worsen
Solution Approach 1:
The patent converts the harmful electromagnetic fields generated by miniaturized devices into beneficial effects by using shorted passive components as electromagnetic shields. These components, when shorted to ground, absorb and redirect electromagnetic interference, turning the problematic EMI into a shielding mechanism that protects sensitive circuit areas.
Solution Approach 2:
The patent makes passive components multi-functional by shorting them to ground, enabling them to simultaneously serve as electromagnetic shields, heat sinks, and inductance tuning elements. This universal approach allows a single component modification to address multiple issues (EMI, heat, inductance) without adding separate dedicated structures.
2Volume of moving object
If surface mount passive components are used in smaller devices, then device miniaturization is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent makes passive components multi-functional by shorting them to ground, enabling them to simultaneously serve as electromagnetic shields, heat sinks, and inductance tuning elements. This universal approach allows a single component modification to address multiple issues (EMI, heat, inductance) without adding separate dedicated structures.
Solution Approach 2:
The patent enables passive components to self-dissipate heat by shorting them to ground, creating a thermal pathway that allows the components to act as heat sinks. The components serve themselves by conducting heat away from critical areas without requiring external active cooling mechanisms.
3Adaptability or versatility
If traditional inductance tuning methods are used, then inductance values can be adjusted, but device complexity and cost increase
Solution Approach 1:
The patent converts the harmful electromagnetic fields generated by miniaturized devices into beneficial effects by using shorted passive components as electromagnetic shields. These components, when shorted to ground, absorb and redirect electromagnetic interference, turning the problematic EMI into a shielding mechanism that protects sensitive circuit areas.
Solution Approach 2:
The patent makes passive components multi-functional by shorting them to ground, enabling them to simultaneously serve as electromagnetic shields, heat sinks, and inductance tuning elements. This universal approach allows a single component modification to address multiple issues (EMI, heat, inductance) without adding separate dedicated structures.
4Object-affected harmful factors
If additional electromagnetic shielding components are added, then electromagnetic interference is reduced, but device size and cost increase
Solution Approach 1:
The patent makes passive components multi-functional by shorting them to ground, enabling them to simultaneously serve as electromagnetic shields, heat sinks, and inductance tuning elements. This universal approach allows a single component modification to address multiple issues (EMI, heat, inductance) without adding separate dedicated structures.
Solution Approach 2:
The patent merges the functions of electromagnetic shielding, heat dissipation, and inductance tuning into existing passive components by shorting them to ground. Instead of adding separate dedicated components for each function, the invention combines multiple functions into single components, reducing overall device size and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shorted surface mount passive component effectively reduces electromagnetic interference, dissipates heat, and tunes inductance values, offering a cost-effective and efficient solution for smaller devices.
Implementation Method 1
the first passive component may be an inductor, a capacitor, or a resistor... the first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted
Implementation Method 2
A first example provides a device that includes a plurality of metal layers, and a plurality of dielectric layers, and a first die coupled to the substrate
Data Source
AI summary
A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.