Shorted Surface Mount Passive Component for EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for cost-effective design structures in smaller devices to address issues such as electromagnetic interference, heat dissipation, and effective inductance tuning, which existing surface mount technology has not adequately resolved.
Innovation Solution
A substrate with multiple metal and dielectric layers, where a surface mount passive component is shorted by coupling its terminals to ground signals, allowing for low-cost electromagnetic shielding, heat dissipation, and inductance tuning through mutual inductance, capacitive, or resistive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional surface mount technology is used for passive components, then device size can be reduced, but electromagnetic interference and heat dissipation problems worsen
Solution Approach 1:
The patent combines multiple functions (electromagnetic shielding, heat dissipation, inductance tuning) into a single shorted passive component structure mounted on the substrate. This merging approach provides comprehensive performance improvement without requiring separate components, thus maintaining compact device size while addressing electromagnetic interference and heat dissipation issues.
Solution Approach 2:
The patent converts the potentially harmful shorted condition of the passive component into a beneficial multi-functional structure. By intentionally shorting the terminals and positioning the component body near signal traces, the structure provides electromagnetic shielding, heat dissipation, and inductance tuning effects, transforming what would normally be a faulty condition into a useful design feature.
2Ease of manufacture
If traditional surface mount technology is used for passive components, then manufacturing is simple, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the passive component body in close proximity to signal traces on the substrate, creating a three-dimensional arrangement that enhances heat dissipation through improved thermal coupling. This spatial arrangement allows heat to dissipate more effectively from the component body to the substrate without complicating the manufacturing process.
3Object-affected harmful factors
If additional components are added for electromagnetic shielding and heat dissipation, then performance improves, but device complexity increases
Solution Approach 1:
The patent makes the passive component universal by enabling it to perform multiple functions simultaneously: electromagnetic shielding, heat dissipation, and inductance tuning. This multi-functionality eliminates the need for separate shielding components, heat sinks, and tuning elements, thereby improving electromagnetic shielding performance without increasing device complexity or component count.
Solution Approach 2:
The patent merges electromagnetic shielding, heat dissipation, and inductance tuning functions into a single integrated structure. By combining these functions that would traditionally require separate components, the invention achieves comprehensive performance improvement while maintaining simple device architecture and avoiding increased complexity.
4Manufacturing precision
If inductance tuning is achieved through additional components, then inductance control improves, but cost increases
Solution Approach 1:
The shorted passive component structure provides self-service for inductance tuning by utilizing its inherent capacitive, inductive, and resistive properties. The component body's proximity to signal traces creates mutual inductance effects that enable precise inductance control without requiring external tuning components, thereby improving inductance control precision while maintaining cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides a low-cost solution for electromagnetic shielding, heat dissipation, and inductance tuning, enhancing the performance of smaller devices by utilizing shorted passive components effectively.
Implementation Method 1
provides a low-cost solution for electromagnetic shielding
Implementation Method 2
heat dissipation
Implementation Method 3
inductance tuning through mutual inductance
Data Source
AI summary
A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.