Shorting Bar Structure for Acid-Pickled Signal Lead Disconnection
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Solution Overview
Problem
During the manufacturing of display panels, metal debris accumulation from laser cutting can cause short circuits between signal leads, leading to abnormal panel displays and reduced yield.
Innovation Solution
A shorting bar with a test signal wiring layer, insulating layer, signal lead layer, and protective layer are sequentially stacked, where the test signal lines or signal leads are made of transparent conductive materials, allowing for disconnection through acid pickling, preventing metal accumulation and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If laser cutting is used to disconnect signal leads after testing, then the test signal line can be disconnected from the shorting bar, but metal debris accumulates at the fracture location causing short circuits between adjacent signal leads
Solution Approach 1:
The patent extracts the harmful metal debris generation process by replacing laser cutting with acid pickling. The signal lead is designed with a pickling-resistant coating that is selectively removed in a specific region, allowing the lead to be dissolved by acid without generating metal debris. This separates the disconnection function from the harmful laser cutting process.
Solution Approach 2:
The patent changes the material parameters of the signal lead by applying a pickling-resistant coating (such as nickel or chromium) that has different chemical resistance properties compared to the base metal. This allows selective dissolution in the exposed region while protecting other regions, enabling clean disconnection without laser-induced debris.
2Productivity
If laser cutting is used to disconnect signal leads, then the testing procedure can be completed, but the yield of display panels is reduced due to short circuits
Solution Approach 1:
The patent performs preliminary action by pre-designing the signal lead with a pickling-resistant coating and an exposed region before the disconnection step. This preparation allows the subsequent acid pickling process to cleanly remove the metal in the exposed region without generating debris that would cause short circuits, thereby maintaining high panel yield while completing the testing procedure.
3Ease of manufacture
If transparent conductive material is used for test signal lines, then acid pickling can be used for disconnection, but the manufacturing process becomes more complex with multiple layers
Solution Approach 1:
The transparent conductive oxide layer serves multiple functions: it provides electrical conductivity for the test signal line during testing, and it acts as a mask during the acid pickling process to protect regions that should not be dissolved. This multi-functionality simplifies the overall process despite the additional layer.
Solution Approach 2:
The signal lead is constructed as a composite structure with a pickling-resistant coating layer and an exposed metal region. This composite design allows selective chemical dissolution, enabling clean disconnection. The composite structure, while adding complexity, provides precise control over the disconnection process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of acid pickling for disconnection effectively avoids short circuits between signal leads, improving panel yield by eliminating the need for laser cutting and preventing metal debris accumulation.
Implementation Method 1
the first through holes are filled with the transparent conductive material so that the signal leads can be disconnected by acid pickling
Data Source
AI summary
The shorting bar includes a test signal wiring layer, an insulating layer, a signal lead layer, a protective layer and a bonding lead layer that are sequentially stacked. The test signal wiring layer is arranged with test signal lines, and the signal lead layer is arranged with signal leads. The test signal lines are made of a transparent conductive material, and a coverage region of the insulating layer and a coverage region of the protective layer are staggered from coverage regions of the test signal lines; or, the signal leads are made of the transparent conductive material, the coverage region of the protective layer is staggered from coverage regions of the signal leads; or, the protective layer is arranged with a plurality of first through holes, and the first through holes correspond to the signal leads in a one-to-one correspondence.


