Shot Region Position Detection Using Partial Mark Analysis
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Solution Overview
Problem
Existing exposure apparatuses in semiconductor manufacturing face challenges in efficiently determining the position of shot regions on a substrate, leading to prolonged measurement times and reduced throughput due to the need to detect multiple marks in each region.
Innovation Solution
A method is introduced where the position of a second shot region is determined by detecting a first mark in the adjacent shot region and a more distant mark in the second region, allowing for the substitution of detection results to reduce the number of marks that need to be detected, thereby shortening measurement time and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple marks are detected in each shot region to ensure measurement accuracy, then measurement precision is improved, but measurement time increases and productivity deteriorates
Solution Approach 1:
The patent applies partial action by detecting only one mark (either second mark or third mark) in the second shot region instead of detecting all marks. This partial detection is sufficient to determine the shot region position when combined with the first mark detection result, thereby reducing measurement time while maintaining adequate measurement precision for productivity improvement
2Manufacturing precision
If all marks in a shot region are detected to determine position accurately, then manufacturing precision is improved, but the time required increases reducing productivity
Solution Approach 1:
The patent applies preliminary action by detecting the first mark in the first shot region before detecting marks in the second shot region. The detection result of the first mark is prepared in advance and used to determine the position of the second shot region, reducing the total measurement time while maintaining manufacturing precision through the sequential detection approach
3Reliability
If the substrate is moved to detect multiple marks, then measurement completeness is improved, but the moving distance increases and measurement time is extended
Solution Approach 1:
The patent extracts the essential detection requirement by identifying that only one mark detection in the second shot region (either second or third mark) is sufficient to determine the shot region position. This extraction eliminates the need to detect all marks, reducing the substrate moving distance and measurement time while maintaining detection reliability through the selective mark detection strategy
Data Source
AI summary
The present invention provides a method of obtaining a position of a second shot region next to a first shot region, out of a plurality of shot regions formed on a substrate, comprising a first detection step of detecting a position of a first mark arranged in the first shot region, a second detection step of detecting a position of a mark more distant from the first mark, out of a second mark and a third mark arranged in the second shot region, and a determination step of determining the position of the second shot region based on a detection result in the first detection step and a detection result in the second detection step.