Semiconductor Shower Head Buffering for Uniform HMDS Gas Injection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional hydrophobic processing apparatuses in semiconductor manufacturing suffer from non-uniform gas distribution due to central vertical injection of HMDS gas, leading to deviations between the center and edge of the wafer, which results in particle formation and ammonia generation.
Innovation Solution
A shower head unit with a buffer space design that includes a guide member, inlet member, and injection member, featuring a central hole, buffer spaces, and exhaust paths to ensure uniform gas distribution across the wafer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If HMDS gas is vertically injected from the center through a central injection structure, then gas supply is simplified, but large deviation occurs between center and edge parts of the wafer
Solution Approach 1:
The gas injection structure is segmented into multiple injection holes distributed across the injection member rather than a single central hole. This segmentation allows gas to be supplied from multiple locations, creating a more uniform distribution pattern across the wafer surface and eliminating the center-edge deviation problem while maintaining structural simplicity.
2Device complexity
If HMDS gas leaks to the outside of the treatment container, then gas supply control is simplified, but particles and ammonia are generated that adversely affect the resist
Solution Approach 1:
A buffer space is introduced as an intermediary chamber between the gas supply source and the wafer surface. This buffer space acts as a mediator that controls gas flow distribution, preventing direct gas leakage to the outside while maintaining simple gas supply control. The buffer space ensures uniform gas distribution and prevents the generation of harmful particles and ammonia.
3Device complexity
If a central vertical injection structure is used, then device structure is simplified, but non-uniform gas distribution causes hydrophobic treatment inconsistency
Solution Approach 1:
The injection member is designed with multiple injection holes at different locations rather than a single central hole. This creates local quality variations in gas flow distribution, where gas is supplied uniformly from multiple points across the wafer surface. This approach maintains simple overall device structure while achieving reliable and consistent hydrophobic treatment uniformity across the entire wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer space design in the shower head unit facilitates uniform gas injection, minimizing eccentricity and enhancing the hydrophobic treatment process by preventing gas leakage and particle formation.
Implementation Method 1
The injection member is disposed under the guide member to inject gas supplied from an outside through the first buffer space of the inflow member and the guide member toward the substrate
Implementation Method 2
a buffer space formed therein so that gas for hydrophobizing a wafer surface can be uniformly discharged
Data Source
AI summary
A shower head unit configured to uniformly discharge gas for minority wafer surfaces in a photo process, a gas supply unit having the shower head unit and a substrate processing device having the gas supply unit are disclosed. A shower head unit includes a guide member, an inlet member and an injection member. The guide member is disposed to cover a substrate disposed within a process chamber. The inlet member is disposed above the guide member to have a first buffer space therein. The injection member is disposed under the guide member to inject gas supplied from an outside through the first buffer space of the inflow member and the guide member toward the substrate. Therefore, a buffer space is formed in a central portion of the shower head unit so as not to generate eccentricity when gas is injected through the shower head unit, so that uniform injection may be performed through the injection member.