Shower Head Slit Arrangement for Uniform Oxide Film Deposition
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Solution Overview
Problem
Chemical vapor deposition techniques for forming oxide films on organic materials face challenges in achieving uniform thickness distribution at low temperatures, as existing methods often result in thickness deviations due to the reactivity of ozone and unsaturated hydrocarbon gases.
Innovation Solution
An oxide film forming device with a shower head design that includes specific arrangements of ozone and unsaturated hydrocarbon gas supply holes or slits, allowing for controlled diffusion and reaction, reducing thickness deviations by optimizing gas flow and pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-concentration ozone gas is used for chemical vapor deposition at low temperatures, then film formation on low heat-resistant substrates becomes possible, but thickness deviation occurs in the oxide film
Solution Approach 1:
The shower head is divided into multiple independent gas supply channels, each equipped with separate flow control mechanisms. This segmentation allows independent optimization of gas flow rates for different regions, compensating for thickness deviations by adjusting local deposition conditions while maintaining low temperature operation
Solution Approach 2:
Different regions of the shower head are designed with locally optimized hole distributions and flow rates. The gas flow characteristics are tailored for specific zones to account for variations in heat transfer and deposition kinetics, ensuring uniform thickness across the substrate while operating at low temperatures where reaction rates are inherently slower
2Manufacturing precision
If chemical vapor deposition is performed at high temperatures, then reaction between gases is promoted and film quality improves, but the temperature exceeds heat resistant temperatures of organic materials
Solution Approach 1:
The process parameters are fundamentally changed by using high-concentration ozone gas which provides highly reactive oxygen species that can oxidize precursor gases at low temperatures. This parameter change substitutes thermal activation with chemical activation, allowing film formation at temperatures suitable for organic substrates while maintaining acceptable film quality through enhanced gas-phase reactivity
Solution Approach 2:
A composite gas system is employed combining high-concentration ozone with organic precursor gases. This composite approach creates a chemically reactive environment where ozone serves as the oxidizing agent and organic precursors provide film-forming elements, enabling low-temperature deposition with good film quality by leveraging the synergistic effects of different gas components
3Manufacturing precision
If shower head holes are made small to improve gas distribution, then deposition uniformity improves, but gas flow resistance increases
Solution Approach 1:
Instead of using a single large hole, the gas supply is segmented into multiple smaller holes distributed across the shower head surface. This segmentation increases the total effective flow area while maintaining small individual hole sizes that provide better gas distribution and deposition uniformity, thereby reducing overall flow resistance
Solution Approach 2:
The hole distribution is optimized in both planar dimensions and depth dimension. Holes are arranged in specific patterns across the shower head surface and at different depths, creating a three-dimensional gas distribution network that improves flow characteristics and deposition uniformity while managing pressure drop through spatial optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves a more uniform oxide film thickness distribution on workpieces, enabling high-quality film deposition at low temperatures without damaging sensitive substrates, even those with low heat resistance, and maintaining high film deposition rates.
Implementation Method 1
a shower head arranged facing a treatment target surface of the workpiece... first holes for supplying an ozone gas to the workpiece and second holes for supplying to the workpiece an unsaturated hydrocarbon gas... allowing for controlled diffusion and reaction
Implementation Method 2
reacting a CVD raw material gas with a reactive species generated through reaction of an ozone gas and an unsaturated hydrocarbon
Implementation Method 3
a method of forming an oxide film on a workpiece by reacting a CVD raw material gas with a reactive species
Data Source
AI summary
Disclosed is an oxide film forming device including a furnace body in which a workpiece is placed and a furnace cover. A mixed gas diffusion part is disposed on an inner side of the furnace cover via a shield plate. A mixed gas buffer space is provided in the mixed gas diffusion part. A shower head plate is disposed on the mixed gas diffusion part and opposed to the workpiece at a distance of 1 to 100 mm away from the workpiece. An ozone gas buffer space is provided in the furnace cover. A gas flow diffusion plate is disposed in the ozone gas buffer space. The shower head plate has formed therein first slits through which an ozone gas flows and second slits through which a mixed gas flows. The first slits and the second slits are alternately arranged side by side in a short-dimension direction of the slits.