Showerhead Cooling Plate With Switchable Thermal Conductivity Paths
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Solution Overview
Problem
Showerheads in substrate processing systems face challenges in thermal management, as existing cooling systems either consume excessive power to heat the showerhead during cleaning processes or require complex setups to compensate for cooling loads, leading to inefficiencies and increased operational complexity.
Innovation Solution
A cooling assembly with multiple independent fluid paths allows for the use of different heat transfer fluids, such as water and helium, to optimize thermal conductivity during deposition and etching processes, while switching to lower thermal conductivity fluids during cleaning processes, thereby reducing unnecessary heating and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single cooling path is used in the cooling plate, then the structure is simple, but the thermal conductivity cannot be modulated to adapt to different process requirements
Solution Approach 1:
The cooling plate is divided into multiple independent cooling paths (first cooling path and second cooling path), each capable of carrying different heat transfer fluids. This segmentation allows selective activation of specific paths based on process requirements, enabling thermal conductivity modulation without requiring complete structural redesign.
Solution Approach 2:
The system dynamically switches between different cooling paths and heat transfer fluids (e.g., helium vs. nitrogen) based on real-time process requirements. During deposition/etching, the first path with high thermal conductivity fluid is activated; during cleaning, the second path with lower thermal conductivity fluid is activated, making the thermal management system adaptive and flexible.
2Reliability
If high thermal conductivity cooling is used continuously, then cooling efficiency is maintained, but power consumption increases unnecessarily during cleaning processes
Solution Approach 1:
The cooling system dynamically adjusts its operation by switching between different cooling paths based on process type. The controller activates the high thermal conductivity first cooling path only when needed (during deposition/etching), and switches to the low thermal conductivity second cooling path during cleaning, thereby maintaining cooling efficiency when required while minimizing power consumption during cleaning processes.
Solution Approach 2:
Different regions of the cooling plate are assigned different thermal conductivity characteristics through separate cooling paths. The first cooling path provides high thermal conductivity for areas needing aggressive cooling, while the second cooling path provides lower thermal conductivity for areas where minimal cooling is desired, allowing localized thermal management that matches process requirements.
3Adaptability or versatility
If different heat transfer fluids are used for different processes, then thermal management is optimized, but the fluid switching system becomes more complex
Solution Approach 1:
The cooling plate incorporates multiple independent cooling paths that can be independently controlled, with each path designed to carry specific heat transfer fluids. This segmentation allows the system to use helium in the first path for high-performance cooling during deposition/etching, and nitrogen or other fluids in the second path for cleaning processes, optimizing thermal management for each process type.
Solution Approach 2:
The cooling plate is designed as a multi-functional component that can handle multiple heat transfer fluids through different cooling paths. The same cooling plate structure serves multiple purposes: it provides high thermal conductivity cooling via the first path during deposition/etching, and low thermal conductivity cooling via the second path during cleaning, eliminating the need for separate cooling systems for different processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise control of thermal conductivity between the cooling plate and the showerhead, enhancing efficiency and reducing operational complexity by minimizing power consumption during processes that do not require cooling.
Implementation Method 1
The second portion is configured to provide heat transfer between the first portion of the cooling plate and the showerhead
Implementation Method 2
a first inlet and a first outlet in fluid communication with a coolant assembly, a first path defined through the cooling plate, in fluid communication with the first inlet and the first outlet, and configured to receive flow of a liquid coolant from the coolant assembly
Data Source
AI summary
A cooling plate for a showerhead in a substrate processing system includes a first portion that defines a first path through the cooling plate. The first portion includes a first inlet configured to receive flow of a first fluid and a first outlet in fluid communication with the first inlet. The first path is in fluid communication with the first inlet and the first outlet. The cooling plate includes a second portion that defines a second path through the cooling plate. The second portion comprises a second inlet configured to receive flow of a second fluid and a second outlet in fluid communication with the second inlet, the second path is in fluid communication with the second inlet and the second outlet, and the second path is not in fluid communication with the first path, the first inlet, and the first outlet.