Showerhead Cooling System for Uniform Gas Distribution
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Solution Overview
Problem
Showerheads in substrate processing apparatuses undergo thermal deformation at high temperatures, leading to non-uniform gas supply and potential particle formation, which can result in non-uniform thin film deposition and process failures due to refrigerant leakage.
Innovation Solution
A showerhead with a cooling system incorporating a flange and flat plate design, featuring a circulation passage for refrigerant flow, injection holes, and a sealing member to prevent refrigerant leakage, ensuring uniform gas distribution and maintaining the showerhead at a controlled temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the showerhead is disposed within the process chamber and subjected to high temperature during deposition processes, then the reaction gas can be supplied for thin film formation, but the showerhead undergoes thermal deformation leading to non-uniform gas supply
Solution Approach 1:
The cooling system is divided into multiple circulation passages (first circulation passage and second circulation passage) that are separately disposed within the showerhead structure. This segmentation allows different regions of the showerhead to be cooled independently, enabling precise temperature control and preventing thermal deformation that would cause non-uniform gas supply.
Solution Approach 2:
A cooling medium (refrigerant) is introduced as an intermediary substance to transfer heat away from the showerhead. The refrigerant circulates through the embedded circulation passages, absorbing thermal energy from the showerhead and maintaining its temperature stability, thereby preventing thermal deformation and ensuring uniform reaction gas supply.
2Temperature
If the showerhead is heated at high temperature to enable deposition process, then the chemical vapor deposition can proceed, but the reaction gas may be deposited within the showerhead or form particles
Solution Approach 1:
The high temperature environment, which initially causes harmful effects like particle formation and gas deposition within the showerhead, is converted into a beneficial condition by introducing the cooling system. The cooling medium absorbs excess heat, maintaining the showerhead at an optimal temperature that enables the deposition process while preventing the formation of particles and unwanted gas deposition.
Solution Approach 2:
The temperature parameter of the showerhead is actively controlled and maintained within a specific range through the cooling system. By changing and stabilizing the temperature parameter, the system enables chemical vapor deposition to proceed effectively while preventing the temperature from reaching levels that would cause particle formation or gas deposition within the showerhead structure.
3Temperature
If a cooling system with refrigerant circulation passages is introduced to prevent thermal deformation, then the showerhead temperature can be controlled, but the device complexity increases
Solution Approach 1:
The cooling system is merged with the existing showerhead structure by embedding the circulation passages directly within the showerhead body. The first and second circulation passages are integrated into different regions of the showerhead, combining the cooling function with the gas supply structure. This integration minimizes additional complexity while achieving effective temperature control.
4Speed
If the refrigerant circulation passage is opened to allow refrigerant flow for cooling, then the showerhead can be cooled quickly, but refrigerant leakage may occur and affect the deposition process
Solution Approach 1:
The potential leakage issue is addressed by extracting and isolating the refrigerant circulation system from the deposition chamber environment. The circulation passages are embedded within the showerhead structure, separating the refrigerant flow path from the reaction gas environment. This extraction prevents refrigerant leakage from affecting the deposition process while maintaining quick cooling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents thermal deformation, ensures uniform thin film deposition, minimizes process failures by maintaining a stable temperature and preventing refrigerant-induced issues, and allows for quick cooling of the showerhead.
Implementation Method 1
a flange (41) having a circulation passage (44) recessed from a top surface thereof to allow a refrigerant to flow therein
Implementation Method 2
a circulation passage (44) recessed from a top surface thereof to allow a refrigerant to flow therein
Implementation Method 3
a flat plate (43) having at least one injection hole (42) for injecting the reaction gas in a thickness direction thereof
Implementation Method 4
a sealing member (47) disposed between the chamber lid and the flange and inside the circulation passage (44)
Data Source
AI summary
Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having an opened upper side, the chamber body providing an inner space in which processes with respect to a substrate are performed, a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body, and a showerhead disposed on a lower portion of the chamber lid to supply a reaction gas into the inner space. The showerhead includes a flange contacting the chamber lid, the flange having a passage recessed from a top surface of the flange to allow a refrigerant to flow therein, and a flat plate disposed inside the flange, the flat plate having at least one injection hole for injecting the reaction gas in a thickness direction thereof.