Showerhead Mask Layer for Plasma Cleaning in Deposition
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Solution Overview
Problem
In integrated circuit technology, the formation of uniform insulating layers during precision via and contact opening is hindered by residual deposition material in processing chambers, leading to defects and contamination issues.
Innovation Solution
A deposition apparatus with an in-situ cleaning function using a gaseous cleaning agent activated with plasma, and a showerhead with a mask layer to prevent etching during plasma cleaning, ensuring stable film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If plasma cleaning is performed to remove residual deposition material from the processing chamber, then the chamber cleanliness is improved, but the showerhead may be etched by the plasma
Solution Approach 1:
A mask layer is introduced as an intermediary protective element between the plasma cleaning agent and the showerhead. This mask layer absorbs the harmful plasma etching effect while allowing the plasma to continue cleaning the chamber walls and other surfaces. The mask layer acts as a sacrificial barrier that protects the critical showerhead components from damage.
Solution Approach 2:
The mask layer is designed as a consumable, disposable component that is intentionally allowed to be damaged or consumed during plasma cleaning operations. Rather than protecting the expensive showerhead permanently, a cheaper, replaceable mask layer is used that can be regenerated or replaced after serving its protective function during cleaning cycles.
2Productivity
If the showerhead is cleaned without protection, then the cleaning effectiveness is improved, but the showerhead structure is damaged
Solution Approach 1:
The mask layer serves as a mediator that enables aggressive plasma cleaning to proceed at full effectiveness while intercepting and absorbing the harmful etching effects before they reach the showerhead structure. This allows the cleaning process to operate at optimal intensity without compromising component integrity.
3Reliability
If a mask layer is added to protect the showerhead, then the showerhead is protected from etching, but the device complexity increases
Solution Approach 1:
The mask layer is applied in advance to the showerhead surface before plasma cleaning operations begin. This preliminary protective action ensures that when the plasma is activated, the showerhead is already protected, eliminating the need for complex real-time protection mechanisms or sophisticated control systems during the cleaning process.
Solution Approach 2:
The mask layer is implemented as a thin film coating rather than a bulky structural modification. This thin film approach provides effective protection while adding minimal complexity to the showerhead design. The mask layer can be applied as a conformal coating that follows the existing showerhead geometry without requiring major design changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively cleans the processing chamber and prevents etching of the showerhead, maintaining uniform film thickness and reducing defects in subsequent depositions.
Implementation Method 1
an in-situ cleaning function using a gaseous cleaning agent activated with plasma
Implementation Method 2
prevents etching of the showerhead during plasma cleaning
Implementation Method 3
chemical vapor deposition (CVD) chambers are used to process work pieces
Data Source
AI summary
A gas dispenser utilized in a deposition apparatus is provided. The gas dispenser includes a showerhead comprising a plurality of holes, and a mask layer formed on a surface of the showerhead, wherein the holes penetrate through the mask layer. A deposition apparatus using the gas dispenser is also disclosed.