Thermal-Shrink Oven Airflow Orifice Adjustment for Uniform Packaging

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Solution Overview

Problem

Existing package thermal-shrinking ovens lack the ability to adjust hot airflow flowrate in real-time according to the shape and size of packaged objects and heat-shrinkable films, leading to inhomogeneous packaging quality, and require complex and costly replacements of airflow control components, necessitating shutdown and professional intervention.

Innovation Solution

An airflow orifice adjusting device with adjustable airflow-blocking plates and levers allows for precise control of airflow orifices, enabling stepless adjustment of airflow flowrate and discharge without shutting down the oven, using a combination of airflow orifice board, track board, adjusting levers, and airflow-blocking plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If hot airflow boxes with different airflow orifices are swapped for different packaged objects, then packaging quality is improved, but installation expenditure and operational complexity increase

Engineering Contradiction:
Improvepackaging qualityVSAvoidhot airflow box swapping
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The airflow control function is segmented from the hot airflow box structure. Adjustable airflow-blocking plates are introduced that can independently modify airflow patterns without replacing the entire hot airflow box. This segmentation allows the box to adapt to different packaging requirements while maintaining a single, permanent installation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transforms the static airflow configuration into a dynamic, adjustable system. Airflow-blocking plates with adjustable positions and angles enable real-time modification of airflow distribution according to different packaged object shapes and sizes, eliminating the need to swap entire hot airflow boxes.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If professional technicians perform hot airflow box swapping, then calibration accuracy is improved, but work hours and labor costs increase

Engineering Contradiction:
Improvecalibration accuracyVSAvoidswapping operation time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The system enables operators to perform airflow adjustment themselves through the adjustable airflow-blocking plates and control mechanisms. This self-service capability eliminates the need for professional technicians to swap hot airflow boxes, reducing both labor costs and calibration time while maintaining accuracy through the designed adjustment mechanisms.

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If hot airflow box swapping is performed, then airflow configuration is optimized, but shutdown requirements and operational downtime increase

Engineering Contradiction:
Improveairflow configurationVSAvoidoperational continuity
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The invention enables dynamic airflow adjustment during operation through adjustable airflow-blocking plates and control mechanisms. Operators can modify airflow configuration without shutting down the thermal-shrinking oven, maintaining operational continuity while adapting to different packaging requirements.

Inventive Principle:
Principle #15Dynamics

4Device complexity

If fixed airflow orifices are used in hot airflow box, then device simplicity is improved, but packaging quality homogeneity deteriorates

Engineering Contradiction:
Improveairflow control structureVSAvoidpackaging quality homogeneity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The airflow control is segmented into multiple adjustable components (airflow-blocking plates, orifice adjustments) rather than using a single fixed structure. This segmentation enables precise control of airflow distribution to different packaging zones, improving quality homogeneity while keeping each component relatively simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention applies local quality adjustment through selectively positioned airflow-blocking plates and adjustable orifices at different locations. Each region of the hot airflow box can be independently adjusted to provide optimal airflow for specific packaged object shapes and sizes, ensuring uniform packaging quality across the entire processing area.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12553668B2Airflow orifice adjusting device of package thermal-shrinking oven
Publication Date: 2026.02.17 HUNG TZU CHIN
  • US12553668B2 patent drawing
  • US12553668B2 patent drawing
  • US12553668B2 patent drawing

AI summary

An airflow orifice adjusting device of a package thermal-shrinking oven includes at least one airflow orifice board mounted to an inside surface of a hot airflow box of the package thermal-shrinking oven and formed with series of airflow orifices, at least one track board mounted to an outside of the hot airflow box and formed with a plurality of track holes, a plurality of adjusting levers, and a plurality of airflow-blocking adjusting plates mounted to the airflow orifice board and each formed with a plurality of adjusting orifices. Each of the airflow orifices of the airflow orifice board discharges a hot airflow. The adjusting levers each have two ends that are respectively formed as a connecting portion and an operating portion. The connecting portion extends through the track holes of the track board to connect to one end of the airflow-blocking adjusting plate, so that a leftward or rightward horizontal moving operation of the operating portion of the adjusting levers causes the airflow-blocking adjusting plate to correspondingly perform a reversely directed horizontal movement in a rightward or leftward direction. The adjusting orifices of the airflow-blocking adjusting plates respectively correspond to the airflow orifices of the airflow orifice board, so that each of the adjusting orifices may completely or partially match with or completely un-match with a corresponding one of the airflow orifices of the airflow orifice board to adjust a discharging flowrate of the hot airflow and discharging of the hot airflow or not.