Shrinkable Target Carrier for Direct μLED Transfer and Contacting
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Solution Overview
Problem
Existing semiconductor transfer processes are inefficient for small components like μLEDs, requiring multiple steps and intermediate carriers, and struggle with achieving reliable electrical and mechanical connections.
Innovation Solution
A structured collecting layer is applied directly to the target carrier, using a shrinkable material that exerts a tensile force on transferred components, allowing for direct attachment without additional intermediate steps and enabling reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a collecting layer is applied over a large area for transfer, then transfer capability is improved, but the process requires one or more intermediate steps and additional transfer steps
Solution Approach 1:
The patent combines the collecting layer directly with the target carrier into a single integrated structure. The collecting layer is applied directly onto the target carrier surface, eliminating the need for separate intermediate transfer carriers and reducing the number of process steps while maintaining effective component transfer capability.
Solution Approach 2:
The target carrier is designed to perform multiple functions: it serves as both the final destination for component attachment and as the collecting layer substrate for transfer operations. This multi-functional design eliminates the need for separate intermediate carriers and simplifies the overall transfer process.
2Reliability
If traditional transfer methods are used for small components like μLEDs, then transfer is possible, but reliable electrical and mechanical connections are difficult to achieve
Solution Approach 1:
The collecting layer is prepared in advance on the target carrier with appropriate adhesive and conductive properties. This preliminary preparation ensures that when small components are transferred, they immediately achieve reliable mechanical and electrical connections without requiring additional alignment or connection steps.
Solution Approach 2:
The collecting layer is formed from composite materials that combine adhesive properties for mechanical bonding with conductive properties for electrical connection. This composite structure enables simultaneous achievement of reliable mechanical attachment and electrical connectivity for small components like μLEDs.
3Ease of manufacture
If intermediate carriers are used for transfer, then transfer process is established, but additional transfer steps and intermediate steps are required
Solution Approach 1:
The patent extracts and removes the intermediate carrier from the transfer process by applying the collecting layer directly to the target carrier. This elimination of the intermediate step reduces process time and simplifies manufacturing while maintaining effective component transfer.
4Device complexity
If structured collecting layer is used directly on target carrier, then intermediate steps are eliminated, but structuring precision is required
Solution Approach 1:
The collecting layer is applied with controlled parameters including thickness, pattern geometry, and material properties that can be optimized for different component sizes. By adjusting these parameters, the structuring precision requirement is reduced while maintaining effective transfer for both small μLEDs and larger components.
Solution Approach 2:
The collecting layer is applied in a manner that provides sufficient coverage and structural definition without requiring extremely precise structuring. The layer extends beyond the immediate contact areas to provide adequate support and connection, allowing for more relaxed structuring tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process by eliminating intermediate steps, ensures reliable mechanical and electrical contacting of small components, and allows for the transfer of both small and larger components with complex designs.
Implementation Method 1
By using a suitable material that changes its volume by means of a shrinking process... the shrinkable collecting layer shrinks, i.e. its volume is reduced. This exerts a tensile force on the component, resulting in improved mechanical and electrical contacting
Implementation Method 2
When components are transferred using a so-called laser-induced forward transfer (LIFT-Off process), components are detached from the source carrier by a laser pulse
Data Source
AI summary
In an embodiment a target carrier for transferring semiconductor components includes a target substrate with at least two contact areas and a shrinkable collecting layer arranged around each of the at least two contact areas and projecting beyond the at least two contact areas, wherein a lateral distance between two opposite edges of the shrinkable collecting layer around each of the at least two contact areas is smaller than a lateral dimension of the at least one contact pad of the semiconductor components, wherein the shrinkable collecting layer around the at least two contact areas is designed such that its structuring is configured to penetrate into the shrinkable collecting layer with a substantially central alignment of the at least one contact pad relative to one of the at least two contact areas.