Shunt Resistor Electroplating and Dicing for Stable Miniaturization

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Solution Overview

Problem

Traditional methods for manufacturing shunt resistors are costly due to high apparatus expenses and thermal welding, leading to electrical stability issues and limitations in miniaturization.

Innovation Solution

A method involving electroplating to form an electrode material layer on a resistance piece, followed by mechanical dicing operations to define the shape and electrodes of the shunt resistor, using tools like dicing blades and CNC milling cutters, without requiring large-scale welding apparatus.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If laser welding method or electron beam welding method is used to combine copper material and alloy material, then the shunt resistor can be manufactured with good bonding strength, but the apparatus cost becomes very high

Engineering Contradiction:

Improvebonding strengthVSAvoidapparatus cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent replaces the thermal welding system (laser or electron beam) with a mechanical bonding system. The copper foil and alloy substrate are bonded through mechanical pressure and adhesion without thermal welding, eliminating the need for expensive welding apparatus while achieving sufficient bonding strength for shunt resistor application.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

Engineering Contradiction:

Improvebonding strengthVSAvoidelectrical stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent replaces thermal welding with mechanical bonding to eliminate heat generation during the bonding process. This prevents heat-induced changes in the alloy substrate that would affect electrical stability, while still achieving adequate bonding strength through mechanical adhesion and pressure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

Engineering Contradiction:

Improvebonding strengthVSAvoidshunt resistor size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent replaces thermal welding with mechanical bonding, which does not have the inherent width limitation of welding processes. This allows the copper foil to be bonded to the alloy substrate in a controlled manner without being constrained by welding beam width, enabling miniaturization of the shunt resistor to SMD 2512 type and smaller.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Volume of moving object

If pressure and heating method is used to bond copper layer and alloy layer, then the shunt resistor can be miniaturized, but large-scale apparatus is required which increases initial cost investment

Engineering Contradiction:

Improveshunt resistor sizeVSAvoidinitial cost investment

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent replaces the pressure and heating system with a simpler mechanical bonding system that uses adhesion and pressure without requiring large-scale heating apparatus. This achieves miniaturization while significantly reducing the initial cost investment in manufacturing equipment.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

5Volume of moving object

If pressure and heating method is used to bond copper layer and alloy layer, then the shunt resistor can be miniaturized, but the material loss rate during pre-production operations becomes high

Engineering Contradiction:

Improveshunt resistor sizeVSAvoidmaterial loss rate

Core Design Contradiction:

Volume of moving objectVSLoss of substance

Solution Approach 1:

The patent replaces the pressure and heating bonding method with a mechanical bonding method that does not require high-temperature processing. This eliminates the need for mechanical grinding to remove excess copper, thereby significantly reducing material loss during pre-production operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves miniaturization of shunt resistors while preventing resistance value drift and reducing production costs by avoiding thermal welding effects and apparatus investments.

Implementation Method 1

An electroplating operation is performed to form an electrode material layer on a surface of the resistance piece

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20260066159A1Method for manufacturing shunt resistor

Publication Date: 2026.03.05 YAGEO CORP

AI summary

A method for manufacturing a shunt resistor is provided. In this method, a resistance piece is attached to an insulating carrier film. An electroplating operation is performed to form an electrode material layer on a surface of the resistance piece. A first mechanical dicing operation is performed to respectively dice the electrode material layer and the resistance piece into plural electrode layers and plural resistance layers to form plural strip structures. Each of the strip structures includes one electrode layer and one resistance layer. A second mechanical dicing operation is performed on the strip structures to dice the electrode layer on each of the strip structures into a first electrode and a second electrode. A third mechanical dicing operation is performed on each of the strip structures to separate each of the strip structures into plural shunt resistors. A trimming operation is performed on each of the shunt resistors.