Shunt Resistor Lead Frame Self-Alignment to Prevent Misassembly
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Solution Overview
Problem
Existing methods for attaching a lead frame to a shunt resistor in semiconductor devices often result in misalignment due to disruptions during epoxy or solder attachment processes.
Innovation Solution
The integration of self-aligning members on the shunt resistor that protrude and extend into corresponding self-aligning features in the lead frame, minimizing rotation and ensuring precise alignment through mechanical interlocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy or solder attachment methods are used to attach the lead frame to the shunt resistor, then the components can be joined together, but misalignment occurs during the attachment process
Solution Approach 1:
Self-aligning members are pre-formed on the shunt resistor before attachment, and self-aligning features are pre-formed in the lead frame. These features are designed in advance to guide and constrain the relative positioning of the components during assembly, ensuring accurate alignment before the actual joining process occurs.
Solution Approach 2:
Self-aligning members act as intermediary elements between the shunt resistor and the lead frame. These members protrude from the shunt resistor and fit into corresponding self-aligning features in the lead frame, serving as a mechanical mediator that establishes precise alignment and transfers positioning information during the attachment process.
2Reliability
If traditional epoxy or solder attachment processes are used, then components can be joined, but production time is increased
Solution Approach 1:
The self-aligning members are extracted as separate, pre-formed features on the shunt resistor, distinct from the main body. This allows them to be formed independently during shunt manufacturing and then simply inserted into the lead frame during assembly, eliminating the need for time-consuming epoxy application and curing or soldering processes while maintaining joint integrity.
Solution Approach 2:
The self-aligning members are designed to automatically perform the alignment function during assembly without requiring external alignment tools or complex positioning procedures. The mechanical interlocking of the self-aligning members with the lead frame features creates a self-positioning system that simplifies the assembly process and reduces production time.
3Reliability
If epoxy and solder are used for attachment, then components can be joined, but costs increase
Solution Approach 1:
The self-aligning members are formed as integral features of the shunt resistor during its manufacturing process, eliminating the need for separate expensive epoxy materials or solder consumables. The mechanical interlocking system replaces costly chemical bonding materials with a simple geometric design that achieves the same joining function at lower material cost.
Data Source
AI summary
An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.