Integrated Shunt Resistor Wiring for Semiconductor Current Detection
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Solution Overview
Problem
The existing configuration of a three-phase AC-DC converter with a bidirectional switch and current detector requires additional wiring to connect chips, leading to an increase in the number of components, which complicates the design and increases costs.
Innovation Solution
A semiconductor device is designed with a shunt resistor that acts as both a current detector and a wiring element, connecting two chips with opposite switching elements, thereby eliminating the need for separate wiring and reducing the overall component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate wiring is added to connect chips with switching elements, then current detection and control functions are achieved, but the number of components increases and design complexity increases
Solution Approach 1:
The patent merges the wiring function and current detection function into a single integrated structure. The wiring connecting the first and second chips inherently serves as the current path, eliminating the need for separate current detection components. This integration reduces the total component count while maintaining both current conduction and detection capabilities.
Solution Approach 2:
The wiring structure is designed to perform multiple functions simultaneously: it serves as the electrical connection between chips, the current conduction path, and the basis for current detection. By making the wiring multi-functional, the patent eliminates redundant components and simplifies the overall device architecture.
2Reliability
If multiple separate components (wiring, current detector, switching elements) are used, then current control is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functional components into an integrated structure where the wiring itself serves as the current detection element. This reduces the number of discrete parts that need to be manufactured, assembled, and tested, thereby simplifying the manufacturing process and reducing production complexity.
3Reliability
If additional wiring is added to connect chips, then electrical connection is achieved, but heat dissipation efficiency decreases due to increased thermal resistance
Solution Approach 1:
By integrating the wiring and current path into a single continuous structure, the patent eliminates additional connection interfaces and joints that would introduce thermal resistance. The unified structure provides both electrical connectivity and efficient thermal conduction, allowing heat to dissipate along the same path that carries the current.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the design by integrating the shunt resistor into the current path, reducing the number of components and enhancing heat dissipation efficiency while maintaining effective current detection and control.
Implementation Method 1
The lead frame further includes a sense terminal connected to both ends of the resistive body of the wiring to detect a voltage drop across the resistive body
Implementation Method 2
The wiring is a shunt resistor that has a resistive body to detect the current flowing through the current path
Data Source
AI summary
A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.