Rotatable Shutter Cover for Substrate Uniformity in Process Chambers
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Solution Overview
Problem
In semiconductor wafer processing, unintended additional deposition occurs on substrates due to condensation of process fluids and residual material in the source delivery system, leading to nonuniformity and inefficiencies in process chambers.
Innovation Solution
A process chamber design incorporating a rotatable shutter cover that moves between a home position exposing the substrate to the showerhead and a cover position to prevent unwanted deposition, featuring a shutter disk and arm mechanism for effective coverage during processing and substrate transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is exposed to the showerhead for deposition processing, then the deposition process can be performed, but unintended additional deposition occurs on the substrate after the process is completed
Solution Approach 1:
The shutter cover is positioned in advance to cover the substrate during transfer operations, and is opened only when the deposition process is about to begin. This preliminary positioning prevents unintended deposition before it occurs, while allowing the full deposition process to proceed without interruption.
Solution Approach 2:
The shutter cover is divided into a shutter disk and shutter arm components that can independently control exposure of different areas of the substrate. This segmentation allows precise control of when and where the substrate is exposed to process fluids, preventing unintended deposition while maintaining processing efficiency.
2Ease of operation
If the substrate is removed from the process chamber after deposition, then substrate transfer can be completed, but unintended deposition continues during the transfer process
Solution Approach 1:
The shutter cover acts as an intermediary barrier between the substrate and the process chamber environment during transfer operations. By positioning the shutter cover to cover the substrate during transfer, it mediates the interaction between the substrate and residual process fluids, preventing unintended deposition while allowing easy substrate transfer.
3Manufacturing precision
If the shutter cover is designed to cover the substrate during transfer, then unintended deposition is prevented, but the device complexity increases
Solution Approach 1:
The shutter cover is designed as a dynamic component that can rotate between a cover position (extending over the substrate support) and a home position (retracted to expose the substrate). This dynamic design allows a single component to perform multiple functions: protecting the substrate during transfer and allowing deposition during processing, without requiring multiple separate mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shutter cover effectively prevents unintended deposition on substrates and substrate supports, reducing nonuniformity by ensuring controlled exposure to process fluids and facilitating efficient substrate handling and processing.
Implementation Method 1
a shutter cover having a shutter disk coupled to a shutter arm, wherein the shutter cover is disposed in the interior volume and rotatably coupled to the chamber body between a home position and a cover position
Data Source
AI summary
Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber body having a bottom plate, a lid, and sidewalls extending from the bottom plate to the lid, wherein one of the sidewalls includes a shutter recess, wherein the chamber body and the shutter recess define an interior volume of the process chamber; a substrate support for supporting a substrate disposed in the interior volume; a showerhead disposed in the interior volume opposite the substrate support; and a shutter cover having a shutter disk coupled to a shutter arm, wherein the shutter cover is disposed in the interior volume and rotatably coupled to the chamber body between a home position and a cover position, wherein in the home position, the shutter cover is at least partially disposed in the shutter recess, and wherein in the cover position, the shutter cover extends over the substrate support.