Shutter Disk In-Situ Metrology for Uniform PVD Thin Films
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Solution Overview
Problem
Current semiconductor deposition systems face challenges in achieving uniformity and quality of thin films due to limitations in in-situ monitoring and re-deposition capabilities, leading to defects in thickness, resistance, and composition during the physical vapor deposition process.
Innovation Solution
A deposition system equipped with an in-situ monitoring and measuring apparatus that includes a shutter disk with optical, x-ray, and resistivity measurement devices, allowing for real-time measurement of thin film characteristics and adjusting the magnetic field to enhance ion bombardment and re-deposition, thereby improving uniformity and preventing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional PVD deposition is used without in-situ monitoring, then the deposition process is simpler and faster, but the uniformity and quality of thin films deteriorate due to lack of real-time control
Solution Approach 1:
The patent combines multiple measurement devices (optical, x-ray, resistivity) and the deposition system into a single integrated platform. The shutter disk serves as both a measurement platform and a deposition target holder, allowing simultaneous or sequential measurement and deposition operations without transferring the substrate, thereby improving thin film uniformity while managing system complexity through functional integration
Solution Approach 2:
The shutter disk is designed to serve multiple functions: it acts as a measurement platform for optical, x-ray, and resistivity measurements, and also serves as a target holder for deposition. This multi-functionality allows the system to perform both characterization and fabrication in one location, improving manufacturing precision through real-time feedback while avoiding the complexity of separate measurement and deposition chambers
2Measurement precision
If multiple separate metrology tools are used to measure thin film characteristics, then measurement comprehensiveness is improved, but production efficiency deteriorates due to substrate transfer time and handling
Solution Approach 1:
The patent merges optical measurement, x-ray measurement, and resistivity measurement capabilities into a single integrated measurement system located on the shutter disk. All measurements are performed in-situ on the substrate without transfer to separate metrology tools, ensuring comprehensive film characteristic analysis while maintaining high productivity by eliminating substrate handling and transfer time
Solution Approach 2:
The substrate serves its own measurement needs by remaining on the shutter disk throughout the process. The shutter disk platform provides all necessary measurement functions (optical, x-ray, resistivity) directly at the deposition location, allowing the system to be self-sufficient and eliminating the need for external metrology tools that would require substrate transfer
3Reliability
If in-situ measurement and re-deposition capability is added, then defect prevention is improved, but device complexity and cost increase
Solution Approach 1:
The patent implements a feedback loop where optical, x-ray, and resistivity measurements are performed in-situ on the thin film during or after deposition. The measurement results are used to determine whether re-deposition is needed to achieve target specifications. This feedback mechanism improves thin film quality and defect prevention by enabling real-time process correction without requiring complex external inspection and rework systems
Solution Approach 2:
The system performs preliminary measurements and assessments during the deposition process itself, allowing detection of potential defects before they become critical. The shutter disk platform enables measurement at intermediate stages, permitting early intervention through re-deposition if needed, thereby improving reliability while managing complexity through proactive rather than reactive quality control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively monitors and adjusts the deposition process in real-time, reducing defects and improving the uniformity and quality of thin films by allowing for precise control over the deposition process without the need for additional metrology tools, thereby enhancing production efficiency and reducing costs.
Implementation Method 1
an optical measurement device that measures a thickness of the thin film on the substrate
Implementation Method 2
an x-ray measurement device that measures a composition of the thin film on the substrate
Implementation Method 3
a resistivity measurement device that measures a resistance of the thin film on the substrate
Implementation Method 4
The physical vapor deposition (PVD) is generally used to deposit one or more layers (e.g., thin film) on the semiconductor substrate
Implementation Method 5
sputtering, a form of the PVD, is commonly used in the semiconductor fabrication process to deposit complex alloys and metals
Implementation Method 6
adjusting the magnetic field to enhance ion bombardment and re-deposition
Data Source
AI summary
A deposition system is provided capable of measuring at least one of the film characteristics (e.g., thickness, resistance, and composition) in the deposition system. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition system in accordance with the present disclosure includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, and a target enclosing the substrate process chamber. A shutter disk including an in-situ measuring device is provided.