Shuttered Wafer Cleaning to Block Residual Drips and Gas Force

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Solution Overview

Problem

During the cleaning of wafers in integrated circuit production, residual liquid from cleaning solutions can drip onto wafers, causing damage and exposure outside the intended environment, and the dispensed liquid and gas can also harm the wafers due to the force at which they are dispensed.

Innovation Solution

A shuttered wafer cleaning system is implemented, featuring a liquid-impermeable shutter that intercepts residual liquid droplets and allows gas to flow, configurable between on and off coverage positions, and a shutter actuator that moves the shutter based on the nozzle's active or inactive state to prevent liquid exposure and manage gas dispensation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If liquid cleaning solutions are dispensed onto wafers, then cleaning effectiveness is improved, but residual liquid can drip onto wafers causing damage and exposure outside intended environment

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidresidual liquid damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

A shutter is introduced as an intermediary component between the liquid dispensing system and the wafer. The shutter intercepts residual liquid droplets that would otherwise drip onto the wafer or escape to the environment, allowing the cleaning process to continue effectively while preventing harmful liquid exposure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cleaning system is segmented into distinct functional zones: an active cleaning zone where liquid is dispensed onto the wafer, and a protected zone where the shutter prevents residual liquid from reaching the wafer or environment. This segmentation allows simultaneous achievement of effective cleaning and harmful factor prevention.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If gas is dispensed at high force to clean wafers, then cleaning effectiveness is improved, but the force of dispensed gas can harm the wafers

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidgas force damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The shutter is made movable rather than fixed, allowing it to dynamically adjust its position. The shutter can be moved to an off coverage position when liquid/gas dispensing is active to allow effective cleaning, and moved to an on coverage position when dispensing stops to intercept residual droplets and reduce gas force impact on the wafer.

Inventive Principle:

Principle #15Dynamics

3Object-affected harmful factors

If a shutter is added to intercept residual liquid, then wafer protection is improved, but device complexity increases

Engineering Contradiction:

Improvewafer protectionVSAvoidsystem complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shutter is implemented as a thin, flexible barrier that can be easily moved between on and off coverage positions. This simple structure provides effective wafer protection while adding minimal complexity to the existing cleaning system.

Inventive Principle:

Principle #30Flexible shells and thin films

4Object-affected harmful factors

If the shutter is moved between on and off coverage positions, then control over liquid and gas exposure is improved, but ease of operation decreases

Engineering Contradiction:

Improveliquid and gas exposure controlVSAvoidoperational simplicity

Core Design Contradiction:

Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The shutter system is configured to automatically move between on and off coverage positions based on the dispensing state, eliminating the need for manual operation. The system self-regulates to provide optimal protection while maintaining cleaning effectiveness.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The shutter position is controlled based on feedback from the dispensing system state. When liquid or gas dispensing is active, the shutter moves to the off coverage position; when dispensing stops, the shutter moves to the on coverage position to intercept residual droplets. This feedback-based control automates the protection mechanism.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively prevents damage from residual liquid and reduces the force of gas on wafers, ensuring safer and more controlled cleaning processes by intercepting drips and optimizing gas flow, thereby enhancing wafer protection and production yield.

Implementation Method 1

a liquid-impermeable shutter that intercepts residual liquid droplets

Methodology Applied

Scientific EffectLiquid impermeability: Physical Containment

Implementation Method 2

allows gas to flow

Methodology Applied

Scientific EffectGas permeability: Physical Containment

Data Source

PatentUS20240363377A1Systems and methods for shuttered wafer cleaning

Publication Date: 2024.10.31 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.