Elastomeric Shuttle Isolation for Smart Munition Shock and Heat

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Solution Overview

Problem

Gun-launched smart munitions face challenges in protecting integrated circuit technologies from extreme shock and thermal conditions due to high acceleration and temperature fluctuations, which conventional hardening methods fail to adequately address, leading to potential failure of electronic components during flight.

Innovation Solution

An isolation assembly is employed that includes a shuttle containing circuit boards, suspended by elastomeric isolators with anti-extrusion rings, providing a spring-damper suspension system to attenuate shock and thermal transfer, allowing the shuttle to move with six degrees of freedom and converting mechanical energy into thermal energy under bulk modulus conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional hardening methods are used to protect electronics, then electronic components are placed directly in the hostile environment, but the electronics fail under extreme shock and thermal conditions

Engineering Contradiction:

Improveelectronic component reliabilityVSAvoidshock and thermal exposure

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system divides the electronics into a separate shuttle module that is physically isolated from the main munition body. The circuit boards are mounted on a shuttle that can move independently within the electronics bay, separating the sensitive electronics from the harsh external environment including shock and thermal exposure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Elastomeric isolators serve as intermediary elements between the shuttle and the electronics bay structure. These isolators attenuate shock forces and thermal transfer, acting as a mediator that protects the electronics from direct exposure to harmful environmental factors while allowing the shuttle to move with six degrees of freedom.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If electronics are isolated using rigid mounting, then structural support is provided, but shock forces are fully transmitted to the electronic components

Engineering Contradiction:

Improvestructural supportVSAvoidshock force transmission

Core Design Contradiction:

StrengthVSForce

Solution Approach 1:

The elastomeric isolators change their mechanical parameters under different conditions. During normal operation, they provide flexible support allowing six degrees of freedom motion. During high-g shock events, the isolators compress and their stiffness increases, providing structural support while attenuating shock forces through non-linear spring behavior and hysteresis damping.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The isolation system uses composite elastomeric materials that combine flexibility for motion isolation with inherent damping properties. The elastomers provide both mechanical support and shock attenuation through their viscoelastic properties, combining the functions of structural support and force reduction in a single material system.

Inventive Principle:

Principle #40Composite materials

3Stability of the object's composition

If the shuttle is constrained to prevent movement, then electronic component stability is improved, but shock attenuation and thermal isolation are reduced

Engineering Contradiction:

Improveelectronic component stabilityVSAvoidshock and thermal protection

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The shuttle is designed to be dynamically movable rather than statically fixed, allowing it to respond to shock forces and thermal expansion. The six degrees of freedom motion capability enables the shuttle to naturally attenuate shock forces through movement, while the elastomeric isolators provide dynamic isolation that adapts to varying operational conditions including high-g acceleration and thermal fluctuations.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly significantly reduces shock amplitude by a factor of at least 3-10 and maintains electronic components within operational limits, ensuring functionality during gun launch and flight by mitigating both shock and thermal stress.

Implementation Method 1

The isolation assembly can be installed into a munition... Upon launch, the isolation assembly attenuates shock forces and thermal transfer to the electronic components

Methodology Applied

Scientific EffectNon-linear spring behavior: Elasticity

Implementation Method 2

converting mechanical energy into thermal energy under bulk modulus conditions

Methodology Applied

Scientific EffectBulk modulus conditions: Compression

Implementation Method 3

the isolation assembly attenuates shock forces and thermal transfer to the electronic components

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12510130B2Shock and thermal protection for smart munitions

Publication Date: 2025.12.30 BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC

AI summary

An isolation assembly for use with a munition includes a housing extending along a central axis and defining a cavity. A shuttle is at least partially within the cavity with an air gap between the shuttle and the housing, where the shuttle is configured to contain one or more electronic components. An isolation assembly in the gap between the shuttle and the housing includes an elastomeric isolator and one or more seals. The isolation assembly retains the shuttle in the cavity with six degrees of freedom.