Multi-Stage Circuit Board Test Shuttle Plate Strain Reduction
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Solution Overview
Problem
Multi-stage circuit board testing introduces strain to the board due to vacuum-induced flexion, leading to potential cracks and faults, especially as the surface area increases and thickness decreases, making tested boards unsuitable for use.
Innovation Solution
The implementation of intermediate members that provide support during testing stages, allowing the circuit board to move freely for full probe contact, reducing strain by interceding between the load plate and shuttle plate, and aligning with blind vias to facilitate additional motion and prevent excessive flexing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multi-stage testing with vacuum-induced motion is used to enable full probe contact, then testing capability is improved, but circuit board strain increases leading to cracks and failures
Solution Approach 1:
A support structure is introduced as an intermediary element between the circuit board and the testing apparatus. This support structure provides mechanical support to the circuit board during vacuum-induced motion, preventing excessive flexion and strain while allowing the testing process to proceed. The support structure acts as a mediator that enables full probe contact without transmitting harmful forces to the circuit board.
2Adaptability or versatility
If the circuit board surface area increases and thickness decreases, then miniaturization and integration are improved, but strain susceptibility increases making boards unsuitable for use
Solution Approach 1:
The support structure is designed with specific local characteristics to provide targeted support where needed. The support structure includes features such as support legs or cushions positioned at strategic locations on the circuit board to provide localized support that prevents flexion without interfering with the overall miniaturized design. This local quality approach allows thin, small circuit boards to maintain their structural integrity during testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces strain on circuit boards during testing, preventing failures and ensuring the boards remain suitable for use by distributing support across the board's surface, thereby maintaining integrity during multiple test stages.
Implementation Method 1
the circuit board is brought into contact with probes by creating a vacuum in a test space that pulls the circuit board downward into the probes
Data Source
AI summary
Multi-stage in circuit test of a circuit board has support to reduce strain placed on the circuit board during each test stage. A shuttle plate is disposed between a load plate that supports a circuit board under test and a probe plate that directs test probes towards the circuit board. The shuttle board slides between different positions with each position establishing the distance between the circuit board and the test probes. For instance, in a first position, the shuttle plate aligns intermediary members to rest between the load plate and shuttle plate to keep the probes spaced by a first distance from the circuit board so that only some test probes contact the circuit board. In a second position, the shuttle plate aligns the intermediary members with blind vias to bring the shuttle plate and load plate proximate each other so that all test probes contact the circuit board.