Si Surface Silylation for Selective Silicon Oxide Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for forming a water repellent film on Si-based surfaces face challenges in achieving selective deposition between surfaces with different chemical compositions, such as between silicon and silicon oxide, due to similar reactivity with silylating agents.
Innovation Solution
A substrate processing method involving a silylation treatment followed by a water repellency adjustment treatment, including pretreatments like removing natural oxidation films and bonding OH groups, to selectively reduce water repellency on one surface relative to another, enabling selective processing treatments like film formation or etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a silylation treatment is applied to Si-based surfaces, then a water repellent film is formed, but selective deposition between surfaces with different chemical compositions (e.g., silicon and silicon oxide) cannot be achieved due to similar reactivity
Solution Approach 1:
The patent applies preliminary actions (pretreatments) before the main silylation treatment to modify surface properties. Specifically, oxidation treatment is performed beforehand to create surface oxide layers on silicon regions, while silicon oxide regions are protected or treated differently. This preliminary differentiation enables subsequent selective silylation deposition based on the created surface property differences.
Solution Approach 2:
The patent creates local quality differences by applying different pretreatments to different regions of the substrate. Silicon regions undergo oxidation treatment to form surface oxides, while silicon oxide regions are either protected or receive different treatment. This creates spatially varying surface properties that enable selective silylation deposition on specific regions only.
2Manufacturing precision
If multiple pretreatment steps are added to achieve selective water repellency, then selective processability is improved, but process complexity increases
Solution Approach 1:
The patent utilizes parameter changes in the form of different chemical treatments (oxidation, silylation) and their sequence to achieve selectivity. By controlling the oxidation conditions and silylation conditions as process parameters, the method creates selective surface properties without requiring complex equipment or multiple specialized treatment chambers.
Solution Approach 2:
The patent employs universal treatment steps that can be applied to various Si-based surfaces. The oxidation treatment and silylation treatment are general processes that work on different silicon-containing materials (silicon, silicon oxide, silicon nitride), providing a versatile methodology that doesn't require specialized equipment for each material type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a substrate processing method with excellent selective processability between Si-based surfaces, allowing for precise film formation or etching treatments by adjusting water repellency, thereby improving substrate manufacturing efficiency.
Implementation Method 1
carrying out a silylation treatment of bringing a silylating agent into contact with the first surface and the second surface
Implementation Method 2
a treatment A-2 of bonding OH to at least a part of Si on the first surface, or a treatment A-2a of bringing an active species containing an oxygen element and/or a gas containing an oxygen element into contact with at least the first surface
Data Source
AI summary
A substrate processing method according to the present invention includes: a preparation step of preparing a substrate that has, on a surface thereof, a first surface which contains Si and a second surface which has a different chemical composition from the first surface and which contains Si; a surface modification step of carrying out a silylation treatment of bringing a silylating agent into contact with the first surface and the second surface and then carrying out a water repellency adjustment treatment of selectively decreasing water repellency of the second surface with respect to the first surface; and a processing step of selectively carrying out a processing treatment with respect to the second surface after the surface modification step.