Silicon Carbide Composite Warping Control via Wet Molding

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Solution Overview

Problem

Conventional methods for manufacturing silicon carbide composites for heat dissipating components face challenges such as warping, uneven thermal conductivity, and low strength, particularly due to issues with binding agents and high-pressure molding processes, which hinder the production of lightweight, high-thermal-conductivity materials with low thermal expansion coefficients suitable for ceramic substrates.

Innovation Solution

A method involving the use of a silica sol with a polyalkylene glycol styrene-maleic anhydride copolymer gelling agent to create a porous silicon carbide molded body, followed by impregnation with an aluminum-based metal, using wet molding techniques to achieve high filling rates and stable thermal properties, eliminating the need for expensive high-pressure equipment and reducing mold wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional binding agents are used in high-pressure molding processes, then molded bodies can be formed, but warping and uneven thermal conductivity occur

Engineering Contradiction:
Improvewarping controlVSAvoidmolding process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention removes binding agents entirely from the molding process. Instead of using conventional binding agents that cause warping and uneven properties, the patent forms green bodies directly from silicon carbide powder without any binding agent, then sinteres them to create the final porous molded body. This extraction of the harmful binding agent component resolves the warping and thermal conductivity uniformity issues.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces the mechanical high-pressure molding system with a sintering-based forming approach. Instead of relying on high-pressure mechanical compression that requires complex equipment and causes warping, the patent uses controlled sintering processes to form the green bodies and subsequent porous structures, substituting mechanical force with thermal processing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If high-pressure molding equipment is used, then dense molded bodies can be produced, but equipment cost and mold wear increase

Engineering Contradiction:
Improvemolded body densityVSAvoidequipment cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention changes the key processing parameters from high-pressure mechanical compression to controlled sintering temperature and atmosphere conditions. By adjusting sintering temperature, holding time, and atmospheric composition, the patent achieves the desired density and porosity without requiring expensive high-pressure equipment, thereby reducing equipment costs and mold wear while maintaining product quality.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of silicon carbide composites with high thermal conductivity (up to 200 W/mK) and low thermal expansion coefficients, minimizing warping and allowing for mass production of lightweight heat sinks with improved strength and uniform properties.

Implementation Method 1

A method involving the use of a silica sol with a polyalkylene glycol styrene-maleic anhydride copolymer gelling agent to create a porous silicon carbide molded body

Methodology Applied
Scientific EffectGelling: Gel

Implementation Method 2

followed by impregnation with an aluminum-based metal, using wet molding techniques to achieve high filling rates

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

This method enables the production of silicon carbide composites with high thermal conductivity (up to 200 W/mK)

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10529591B2Method for producing silicon carbide composite material
Publication Date: 2020.01.07 DENKA CO LTD

AI summary

A silicon carbide composite that is lightweight and has high thermal conductivity as well as a low thermal expansion coefficient close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipating components that are required to be particularly free of warping, such as heat sinks. A method for manufacturing a silicon carbide composite obtained by impregnating a porous silicon carbide molded body with a metal having aluminum as a main component, wherein the method for manufacturing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the wet molding method is a wet press method or is a wet casting method.