SiC Crystal Cutting Sequence for Flat Crossed Cut Surfaces

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Solution Overview

Problem

Hexagonal crystal structures, such as SiC, tend to crack easily along nearest neighbor directions and are difficult to crack along intersecting directions, leading to bulging issues during cutting processes.

Innovation Solution

A crystal cutting method involving two distinct cutting directions: the first cut along the [1-100] direction to minimize stress discontinuity and the second cut along the [11-20] direction to apply stress along the nearest neighbor direction, thereby reducing bulging and improving flatness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the crystal structure body is cut along the nearest neighbor direction, then the cutting process is easier, but bulging portions are formed at the cut portions

Engineering Contradiction:
Improveease of cuttingVSAvoidflatness of cut portion
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The cutting process is divided into multiple sequential steps with different cutting directions. The first cutting step cuts along the nearest neighbor direction, and the second cutting step cuts along the nearest neighbor direction intersecting direction, thereby segmenting the single cutting operation into controlled stages that prevent bulging.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of cutting only along the nearest neighbor direction, the method inverts the approach by introducing cuts along the intersecting direction. This reverse approach to the conventional single-direction cutting prevents the formation of bulging portions while maintaining manufacturability.

Inventive Principle:
Principle #13The other way round (Inversion)

2Manufacturing precision

If the crystal structure body is cut along the nearest neighbor direction intersecting direction, then the flatness is improved, but the cutting process becomes more difficult

Engineering Contradiction:
Improveflatness of cut portionVSAvoidease of cutting
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The difficult cutting operation along the intersecting direction is segmented into a second step that follows an easier first cutting step. This segmentation allows the challenging cut to be performed when the crystal structure has already been partially prepared, reducing overall difficulty.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first cutting step along the nearest neighbor direction is performed as a preliminary action before the second cutting step. This preliminary cut prepares the crystal structure body, making the subsequent difficult cut along the intersecting direction more manageable while ensuring flatness.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If multiple cutting steps are performed, then the flatness and cutting quality are improved, but the processing time increases

Engineering Contradiction:
Improveflatness of cut portionVSAvoidcutting processing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

Different cutting directions are applied locally to different steps of the cutting process. The first step uses one direction optimized for ease of cutting, while the second step uses another direction optimized for flatness, thereby achieving high precision without excessive time loss through targeted local optimization.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240261994A1CRYSTAL CUTTING METHOD, METHOD OF MANUFACTURING SiC SEMICONDUCTOR DEVICE, AND SiC SEMICONDUCTOR DEVICE
Publication Date: 2024.08.08 ROHM CO LTD
  • US20240261994A1 patent drawing
  • US20240261994A1 patent drawing
  • US20240261994A1 patent drawing

AI summary

A crystal cutting method includes a step of preparing a crystal structure body constituted of a hexagonal crystal, a first cutting step of cutting the crystal structure body along a [1-100] direction of the hexagonal crystal and forming a first cut portion in the crystal structure body and a second cutting step of cutting the crystal structure body along a [11-20] direction of the hexagonal crystal and forming a second cut portion crossing the first cut portion in the crystal structure body.