SiC Semiconductor Device Heat Stress Management
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Solution Overview
Problem
Semiconductor devices using silicon carbide chips face poor heat dissipation properties due to the need for elastic bodies to reduce heat stress, which degrades their thermal management capabilities.
Innovation Solution
A semiconductor device configuration where metal members are positioned adjacent to both surfaces of the silicon carbide chip with a specific shortest distance relationship, reducing heat stress resistance without the need for elastic bodies by optimizing the positional relationship between the chip and metal members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an elastic body is used to reduce heat stress, then the resistance of the semiconductor chip to heat stress is improved, but the heat dissipation property deteriorates
Solution Approach 1:
The invention extracts the stress-reducing function from the elastic body and transfers it to the semiconductor chip itself through structural design. The chip is configured with a specific shape (e.g., recessed portions or protrusions) that directly reduces heat stress without requiring an elastic body, thereby eliminating the heat dissipation problem caused by the elastic body while maintaining stress resistance.
Solution Approach 2:
The invention changes the physical parameters of the semiconductor chip, such as its shape, dimensions, or material properties, to inherently reduce heat stress. By modifying the chip's structural parameters (e.g., adding recesses, changing thickness distribution), the chip can withstand heat stress better while maintaining direct thermal contact for efficient heat dissipation.
2Reliability
If a plate-like die pad is used to connect to the back surface electrode, then the electrical connection is established, but the heat stress resistance is insufficient without additional elastic components
Solution Approach 1:
The invention merges the stress-reducing function with the die pad structure itself. The die pad is designed with integrated features (such as recessed portions or specific geometric shapes) that provide both electrical connection and heat stress resistance in a single component, eliminating the need for separate elastic bodies and simplifying the overall device structure.
Solution Approach 2:
The die pad is designed to perform multiple functions simultaneously: electrical connection, mechanical support, and heat stress resistance. By giving the die pad a multi-functional design with specific structural features, it can withstand heat stress without requiring additional elastic components, thereby reducing device complexity.
Data Source
AI summary
A semiconductor device includes a semiconductor chip formed using a silicon carbide and having electrodes on a first surface and a second surface opposite to the first surface, a terminal disposed adjacent to the first surface and connected to the electrode on the first surface through a bonding member, and a heat sink disposed adjacent to the second surface and connected to the electrode on the second surface through a bonding member. The first surface is a (0001) plane and a thickness direction of the semiconductor chip corresponds to a [0001] direction. Of the distances between the end portions of the semiconductor chip having a square two-dimensional shape and the end portions of the terminal having a rectangular two-dimensional shape, the shortest distance L1 in a [1-100] direction is shorter than the shortest distance L2 in a [11-20] direction.