SiC Diode Power Converter Thermal Management

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Solution Overview

Problem

High-power power converters face thermal management challenges due to high voltage and current thermal losses, leading to potential thermal failure and inefficiency, especially in converting high-power electrical energy.

Innovation Solution

A power converter design incorporating a circuit board with silicon carbide diodes arranged in parallel and strategically spaced to prevent thermal failure, combined with a thermal composite and heat exchanger assembly for effective heat management, utilizing a coolant system to maintain components within safe temperature limits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If higher power conversion is implemented, then power output is improved, but thermal losses increase leading to potential thermal failure

Engineering Contradiction:
Improvepower outputVSAvoidthermal losses
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent divides the power conversion function into multiple parallel diode modules rather than using a single high-power diode. Each diode handles a portion of the total current, distributing thermal loads across multiple discrete components. This segmentation allows better thermal management by preventing any single component from experiencing excessive heat generation that would lead to thermal failure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements different thermal management strategies for different parts of the system. Specifically, it uses thermally conductive material at the mounting interface between diodes and the heat sink, while using electrically insulating material in other areas. This local differentiation of material properties optimizes heat transfer from critical hot spots while maintaining electrical isolation where needed.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If multiple diodes are arranged in parallel, then current handling capacity is improved, but thermal management complexity increases

Engineering Contradiction:
Improvecurrent handling capacityVSAvoidthermal management complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent combines multiple diodes into a single integrated module assembly where all diodes are mounted on a common heat sink structure. This merging approach allows the thermal management system to treat the entire diode array as a unified thermal load, simplifying the cooling design compared to managing each diode separately. The common heat sink provides a centralized heat dissipation path for all parallel diodes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a thermally conductive mounting structure as an intermediary between the diode array and the cooling system. This intermediary component efficiently transfers heat from multiple diode junctions to the heat sink while maintaining electrical isolation. The mounting structure acts as a thermal mediator that simplifies the thermal management of parallel diodes by providing a unified heat transfer path.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents thermal failure and maintains high efficiency by managing heat through the use of silicon carbide diodes and a comprehensive cooling system, allowing for reliable high-power conversions while keeping heat-sensitive components within safe temperature ranges.

Implementation Method 1

converting between AC and DC, or modifying any combination of voltage, current, and/or frequency from an input power to a resulting output power. Higher-power converters may include components capable of dealing with higher temperature operation due to, for example, high voltage and/or high current thermal losses.

Methodology Applied
Scientific EffectJoule Heating: Joule Heating

Implementation Method 2

combined with a thermal composite and heat exchanger assembly for effective heat management, utilizing a coolant system to maintain components within safe temperature limits.

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

combined with a thermal composite and heat exchanger assembly for effective heat management

Methodology Applied
Scientific EffectHeat Exchanger: Heat Exchanger

Data Source

PatentUS9680385B2Power converter
Publication Date: 2017.06.13 GE AVIATION SYSTEMS LLC
  • US9680385B2 patent drawing
  • US9680385B2 patent drawing
  • US9680385B2 patent drawing

AI summary

A power converter includes a circuit board having an elongated anode receiving an input voltage and an input current and an elongated cathode providing an output voltage and an output current, and a plurality of diodes electrically arranged in parallel between the anode and cathode. The parallel diodes convert the input voltage to an output voltage, convert the input current to an output current.