Silicon Carbide Honeycomb Structure Segmentation
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Solution Overview
Problem
The manufacturing of large honeycomb structures using silicon carbide as a material is inefficient due to thermal shock issues and requires additional processing steps like rough processing and grinding, leading to reduced raw material yield and increased manufacturing time.
Innovation Solution
A method where notches are formed in the honeycomb structure to partition partial segments, eliminating the need for outer peripheral cutting and grinding, and a buffer portion is filled between segments to absorb thermal expansion, thereby improving manufacturing efficiency and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple small honeycomb segments are manufactured and bonded to form large structures, then thermal shock resistance is improved, but manufacturing complexity and processing time increase
Solution Approach 1:
The honeycomb structure is divided into multiple segments along the longitudinal direction, with each segment separated by partition walls. This segmentation allows the structure to expand and contract independently during thermal cycles, preventing stress concentration and improving thermal shock resistance while simplifying the manufacturing process.
2Manufacturing precision
If outer periphery rough processing and grinding are performed, then shape accuracy is improved, but raw material yield is reduced
Solution Approach 1:
The partition walls are formed during the initial molding process rather than requiring subsequent processing. This preliminary formation of segmentation structures eliminates the need for outer periphery rough processing and grinding, thereby preserving raw material and improving yield while maintaining shape accuracy.
3Strength
If multiple processing steps are added to handle thermal expansion, then structural integrity is improved, but manufacturing efficiency is reduced
Solution Approach 1:
The partition walls are designed with specific dimensional parameters and material properties that allow them to accommodate thermal expansion and contraction of the honeycomb segments. This design approach maintains structural integrity during thermal cycles while eliminating the need for additional processing steps, thereby improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal shock resistance and eliminates the need for extra processing steps, resulting in improved raw material yield and manufacturing efficiency while maintaining structural integrity.
Implementation Method 1
a buffer portion (5) arranged between the partial segments (3) adjacent to each other in the aggregate (120) of the partial segments
Implementation Method 2
a defect may occur in a large honeycomb structure formed by using the silicon carbide as an aggregate due to, e.g., a thermal shock at the time of use
Data Source
Figure 1
Figure 2
Figure 3~4B
AI summary
A manufacturing method of a honeycomb structure that can improve a manufacturing efficiency and a raw material yield is provided. There is provided a manufacturing method of a honeycomb structure comprising: subjecting a raw material to extrusion forming to form a honeycomb formed body 100 having a partition wall that partitions a plurality of cells that serve as flow paths for a fluid and are extended from one end surface to the other end surface; forming a plurality of notches extended in a direction along which the cells are extended in the honeycomb formed body 100 to form a partial segment aggregate 120 in such a manner that a plurality of partial segments 3 are partitioned; and forming a buffer portion 5 between respective partial segments 3 adjacent to each other in the partial segment aggregate 120 to fill an entire space between the respective partial segments adjacent to each other, thereby obtaining a honeycomb structure 130.