SiC-SiO2 Interface Engineering with Nitrogen-Rich Transition Region

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Solution Overview

Problem

In silicon carbide semiconductor devices, defects at the interface between the silicon carbide and silicon dioxide layers hinder performance, particularly in reducing defects and enhancing field-effect mobility.

Innovation Solution

A transition region with a high concentration of nitrogen, carbon, and oxygen is introduced between the silicon carbide and silicon dioxide layers, formed through a heat treatment process in an NO gas atmosphere, which increases nitrogen accumulation and reduces defects, thereby improving the device's electric characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a silicon dioxide layer is formed directly on a silicon carbide layer, then the device structure is simple, but defects occur at the interface between the layers

Engineering Contradiction:
Improveinterface qualityVSAvoidlayer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A transition region containing nitrogen is introduced between the silicon carbide layer and the silicon dioxide layer. This transition region acts as an intermediary layer that reduces defects at the interface, improving the overall interface quality without requiring direct contact between the silicon carbide and silicon dioxide layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The transition region is created with a specific local composition containing nitrogen at a concentration of 1.0×10^20 cm^-3 or higher, which is five or more times higher than the maximum nitrogen concentration in the silicon dioxide layer. This localized modification of composition and structure addresses the interface defect problem without changing the overall device structure.

Inventive Principle:
Principle #3Local quality

2Reliability

If nitrogen concentration is increased in the transition region, then field-effect mobility is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvefield-effect mobilityVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The nitrogen concentration in the transition region is controlled to be 1.0×10^20 cm^-3 or higher, which is five or more times higher than the maximum nitrogen concentration in the silicon dioxide layer. By optimizing this specific parameter (nitrogen concentration), field-effect mobility is improved while maintaining a manageable manufacturing process through precise control of heat treatment conditions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The introduction of a nitrogen-rich transition region enhances the field-effect mobility and improves the electric characteristics of silicon carbide semiconductor devices by reducing defects at the interface, leading to better performance.

Implementation Method 1

A transition region with a high concentration of nitrogen, carbon, and oxygen is introduced between the silicon carbide and silicon dioxide layers, formed through a heat treatment process in an NO gas atmosphere, which increases nitrogen accumulation

Methodology Applied
Scientific EffectNitrogen diffusion: Diffusion

Data Source

PatentUS11888035B2Silicon carbide semiconductor device
Publication Date: 2024.01.30 FUJI ELECTRIC CO LTD
  • US11888035B2 patent drawing
  • US11888035B2 patent drawing
  • US11888035B2 patent drawing

AI summary

The silicon carbide semiconductor device includes: a silicon carbide layer; a silicon dioxide layer provided above the silicon carbide layer and containing nitrogen; and a transition region arranged between the silicon carbide layer and the silicon dioxide layer, and containing carbon, oxygen, and nitrogen, wherein the maximum nitrogen concentration in the transition region is 1.0×1020 cm−3 or higher. The maximum nitrogen concentration in the transition region is five or more times higher than the maximum nitrogen concentration in the silicon dioxide layer.