SiC Solid-Body Layer Separation for Precision Substrate Thinning
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Solution Overview
Problem
The semiconductor industry faces challenges in thinning semiconductor substrates, leading to material loss and potential damage to processed components during conventional grinding and polishing steps.
Innovation Solution
A method involving the creation of laser modifications within the solid body to form a detachment plane, followed by the introduction of external forces to generate tensions and initiate crack propagation, allowing for the separation of solid-body layers without mechanical machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional grinding and polishing steps are used to thin semiconductor substrates, then the desired substrate thickness is achieved, but material is lost and processed components may be damaged
Solution Approach 1:
The patent applies preliminary action by creating laser modifications and a detachment plane within the solid body before the actual separation process. The laser modifications are introduced at a predetermined depth to form a detachment plane that enables subsequent clean separation without requiring aggressive grinding or polishing, thereby preventing material loss while achieving the desired thickness precision.
Solution Approach 2:
The patent replaces the conventional mechanical grinding and polishing system with a laser-based modification system followed by controlled separation. Instead of using mechanical abrasion to remove material, the invention uses laser energy to create internal modifications and a detachment plane, then applies mechanical force to initiate crack propagation along this pre-defined plane, achieving precise thinning without material loss.
2Manufacturing precision
If conventional grinding and polishing steps are used to thin semiconductor substrates, then the desired substrate thickness is achieved, but processed components may be damaged
Solution Approach 1:
The detachment plane is created in advance through laser modifications before any separation force is applied. This preliminary structuring ensures that when mechanical force is introduced, crack propagation occurs precisely along the pre-defined detachment plane, protecting processed components from damage that would otherwise occur during conventional grinding or polishing operations.
Solution Approach 2:
The patent replaces the harmful mechanical grinding and polishing processes with a controlled separation mechanism. Instead of subjecting processed components to abrasive forces that can cause damage, the invention uses laser-created detachment planes combined with controlled crack propagation to achieve thickness reduction while preserving component integrity.
3Manufacturing precision
If polymer layer is used for separation as described in WO 2014/177721 A1, then solid-body layer can be separated, but polymer removal takes several hours limiting industrial use
Solution Approach 1:
The patent extracts and eliminates the time-consuming polymer removal step from the separation process. Instead of using a polymer layer that requires lengthy chemical or mechanical removal, the invention directly creates a detachment plane within the solid body using laser modifications, allowing the solid-body layer to be separated without any auxiliary material that would need subsequent removal.
Solution Approach 2:
The patent introduces laser modifications as an intermediary mechanism to create the detachment plane, replacing the polymer layer intermediary used in conventional methods. These laser modifications serve as the mediating structure that enables clean separation without requiring the introduction and subsequent removal of polymer materials, thereby dramatically reducing process time.
4Stability of the object's composition
If fillers are introduced in polymer as described in WO 2010/072675 A2, then thermal expansion coefficients or elasticity modulus can be influenced, but adhesion of polymer to solid body surface is impaired
Solution Approach 1:
The patent extracts and eliminates the polymer-filler composite system entirely, replacing it with direct laser modifications within the solid body. By removing the polymer layer and its fillers, the invention eliminates the adhesion problem caused by fillers while still achieving the desired separation function through laser-created detachment planes that do not require auxiliary materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the thinning of semiconductor substrates while preserving material and reducing wafer losses, allowing for the production of high-quality electrical components with minimal material waste and tool wear.
Implementation Method 1
creating a plurality of modifications by means of laser beams within the interior space of the solid body to form a detachment plane
Implementation Method 2
introducing an external force into the solid body for generating tensions within the solid body, wherein the external force is so strong that the tensions initialize a crack propagation along the detachment plane
Data Source
AI summary
A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.