Sintered Silicon Carbide Heat Sink for LED Thermal Management
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Solution Overview
Problem
Solid state light emitters, such as LEDs, face challenges with heat dissipation, as elevated temperatures reduce their operational efficiency and lifespan, and affect the stability of white light output, necessitating effective thermal management solutions.
Innovation Solution
The use of sintered silicon carbide or sintered mixtures containing silicon carbide as heat dissipation elements in lighting devices, which provide excellent structural support and thermal conductivity, matched to the thermal expansion of silicon carbide-based semiconductor devices, while allowing for minimal light absorption and reflection, thereby maintaining junction temperatures within acceptable ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If solid state light emitters are operated at elevated temperatures, then light output intensity increases, but operational lifetime is significantly shortened
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional LED package structure by introducing a transparent heat sink that physically separates the light emission path from the heat conduction path, allowing heat to be removed while preserving light output
Solution Approach 2:
The transparent heat sink acts as an intermediary element between the LED junction and the ambient environment, conducting heat away while being transparent to visible light, thus mediating between thermal management requirements and optical performance
2Temperature
If heat dissipation structures are added to LED fixtures, then junction temperature is reduced, but light output is absorbed or reflected
Solution Approach 1:
The heat sink material is selected to be transparent in the visible spectrum while having high thermal conductivity, creating a material that simultaneously allows light to pass through while conducting heat away from the junction
Solution Approach 2:
The patent employs composite or specially formulated transparent materials for the heat sink that combine optical transparency with high thermal conductivity properties, merging previously separate functional requirements into a single component
3Loss of energy
If conventional opaque heat sinks are used, then heat dissipation is effective, but light transmission is blocked
Solution Approach 1:
The patent extracts the light-blocking property from the heat sink design, separating the heat conduction function from the light transmission path by making the heat sink material transparent to visible wavelengths
Solution Approach 2:
The transparent heat sink serves multiple functions simultaneously: it acts as a thermal conduction path, a structural support element, and an optically transparent window, eliminating the need for separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from LEDs, enhancing their operational efficiency, stability, and lifespan, while maintaining consistent white light output by reducing thermal expansion issues and allowing more light to exit the device.
Implementation Method 1
sintered silicon carbide or sintered mixtures containing silicon carbide as heat dissipation elements in lighting devices, which provide excellent structural support and thermal conductivity
Implementation Method 2
sintered silicon carbide or sintered mixtures containing silicon carbide as heat dissipation elements
Data Source
AI summary
A lighting device comprising at least a first light source and at least a first heat dissipation element. At least a first region of the dissipation element comprises at least one material selected from among (1) sintered silicon carbide, (2) a sintered mixture of silicon carbide and at least one other ceramic material, (3) a sintered mixture of silicon carbide and at least one metal other than aluminum, (4) a sintered mixture of silicon carbide, at least one other ceramic material and at least one metal other than aluminum and (5) a sintered mixture of silicon carbide, at least one other ceramic material and at least one metal. Also, a lighting device comprising at least a first light source and heat conducting means for dissipating heat.