SiC Member Multilayer Interface Appearance Control
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Solution Overview
Problem
In semiconductor manufacturing apparatuses, slight processing variations can lead to product defects in wafers, which may spread to multiple wafers, and the interface between SiC layers in recessed SiC members can compromise the appearance and quality of these components.
Innovation Solution
A SiC member is designed with a multilayer structure where the upper and lower surfaces of the recessed area have complementary concavo-convex shapes, ensuring that the interface does not appear on the bottom surface, and the machining distances are adjusted to maintain equalities that prevent interface visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the SiC plate is formed by repeating CVD several times to achieve high purity and durability, then the multilayered structure is created, but the interface between layers may appear on the recess bottom surface compromising appearance
Solution Approach 1:
The patent applies preliminary action by forming concavo-convex shapes on the upper surface of the first SiC layer before creating the recess. This pre-shaping ensures that when the second SiC layer is deposited and the recess is formed, the interface between layers will not appear on the bottom surface of the recess, thus preventing the appearance issue before it can occur.
Solution Approach 2:
The patent applies local quality by creating complementary concavo-convex shapes at specific locations (the interface between first and second SiC layers) while keeping other areas flat. This localized modification ensures the interface is hidden only where it matters (at the recess bottom) without affecting the overall structure or requiring changes to the entire component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration secures a favorable appearance of the SiC member by preventing interface visibility on the recess bottom surface, enhancing the quality and reliability of semiconductor manufacturing components.
Implementation Method 1
a first SiC layer (3) having a first upper surface (11) having a concavo-convex shape and a first lower surface (13); and a second SiC layer (5) having a second upper surface (15) and a second lower surface (17), the second lower surface (17) being in contact with the first upper surface (11)
Data Source
AI summary
A technology for securing favorable appearance of a SiC member, the SiC member includes: a first SiC layer having a first upper surface having a concavo-convex shape and a first lower surface; and a second SiC layer having a second upper surface and a second lower surface, the second lower surface being in contact with the first upper surface and having a concavo-convex shape corresponding to that of the first upper surface. The second SiC layer has a recess concaved from the second upper surface toward the second lower surface side and a flat bottom surface, and the bottom surface of the recess is placed upward of the second lower surface.