Silicon Carbide Module Heat Sink Bonding for Better Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation creams used in silicon carbide modules have low thermal conductivity, limiting their ability to efficiently transfer heat away from high-power, high-integration semiconductor components, which is inadequate for the thermal management needs of modern electronic products.
Innovation Solution
A silicon carbide module integrated with a heat sink using solder paste, where the solder paste is melted at a low temperature (130° C. to 140° C.) to weld the heat sink to the module, utilizing a Sn-Bi or Sn-Bi-Ag alloy with flux to enhance thermal conductivity and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat dissipation cream is used to attach the heat sink to the silicon carbide module, then the assembly process is simple, but the thermal conductivity is low (K=2.5) and heat transfer efficiency is poor
Solution Approach 1:
The patent changes the material parameter from conventional heat dissipation cream to solder paste, which fundamentally alters the thermal conductivity parameter from K=2.5 to K>40, thereby resolving the contradiction between assembly simplicity and heat transfer efficiency
Solution Approach 2:
The patent uses solder paste as a composite material that combines the benefits of thermal conductivity (K>40) with adhesive properties, enabling both effective heat transfer and reliable mechanical bonding between the heat sink and silicon carbide module
2Reliability
If the contact area between the silicon carbide module and heat sink is increased, then heat dissipation efficiency improves, but the actual contact area is limited by surface defects and air gaps with high thermal resistance
Solution Approach 1:
The patent introduces solder paste as an intermediary material that fills the gaps and defects between the heat sink and silicon carbide module, eliminating air pockets with high thermal resistance and creating continuous thermal pathways, thus improving heat dissipation efficiency
Solution Approach 2:
The solder paste's paste structure allows it to penetrate and fill microscopic pores and defects on the contact surfaces, ensuring maximum contact area and eliminating thermal resistance barriers caused by surface imperfections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high thermal conductivity of the solder paste allows for effective heat transfer from the silicon carbide module to the heat sink, significantly improving the heat dissipation efficiency and reducing the module's temperature, thereby addressing the limitations of traditional heat dissipation methods.
Implementation Method 1
solder paste with high thermal conductivity (K > 40) to improve heat dissipation
Implementation Method 2
welded at a low temperature (130° C. to 140° C.) to enhance heat conduction
Data Source
AI summary
A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.