Silicon Carbide Ohmic Contact Formation via Nickel Grinding

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Solution Overview

Problem

Existing methods for forming electrical contacts on silicon carbide substrates require multiple process steps, including surface roughening and metal deposition, which increase manufacturing costs and complexity.

Innovation Solution

A method involving grinding a silicon carbide surface with a nickel-containing grinding disk to embed nickel particles, followed by laser hardening to form nickel silicide, which combines surface roughening and metal deposition into a single process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple process steps (surface roughening + metal deposition) are used to form electrical contacts on silicon carbide, then the contact quality can be improved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvecontact qualityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines surface roughening and metal deposition into a single grinding process by incorporating metal particles into the grinding disk. This merging of operations reduces the total number of process steps while maintaining effective contact formation, directly resolving the contradiction between contact quality and manufacturing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal particles are pre-incorporated into the grinding disk before the grinding process begins. This preliminary preparation allows the metal deposition to occur simultaneously with surface roughening during the grinding operation, eliminating the need for a separate deposition step and reducing overall process complexity

Inventive Principle:
Principle #10Preliminary action

2Reliability

If multiple process steps are used for surface preparation and metal deposition, then the electrical contact performance can be optimized, but the manufacturing time increases

Engineering Contradiction:
Improveelectrical contact performanceVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By merging surface roughening and metal deposition into one concurrent grinding operation, the patent reduces the total manufacturing time required to form electrical contacts. The simultaneous execution of both functions in a single process step directly addresses the productivity concern while maintaining contact performance

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The grinding process continuously performs both surface roughening and metal deposition simultaneously throughout the operation. This continuous dual-action approach eliminates idle time between separate processes and maximizes the efficiency of the manufacturing step, thereby improving overall productivity

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the formation of ohmic contacts with reduced contact resistance, achieving a contact resistance of less than 1 mΩcm² and lowering manufacturing costs by reducing the number of process steps.

Implementation Method 1

hardening the ground silicon carbide surface with the aid of a laser

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

at least some of the embedded nickel particles form a nickel silicide with silicon from the silicon carbide

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

grinding a silicon carbide surface using a grinding disk which includes a grinding face containing nickel or a nickel compound. In this case, grinding may be performed such that particles of the nickel or nickel compound from the grinding disk are embedded in the ground silicon carbide surface

Methodology Applied
Scientific EffectMechanical embedding: Abrasion

Implementation Method 4

at least some of the embedded nickel particles form a nickel silicide with silicon from the silicon carbide

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentUS12255068B2Method for forming an electrical contact and method for forming a semiconductor device
Publication Date: 2025.03.18 ROBERT BOSCH GMBH
  • US12255068B2 patent drawing
  • US12255068B2 patent drawing

AI summary

A method for forming an electrical contact is provided. The method includes grinding a silicon carbide surface using a grinding disk which includes a grinding face containing nickel or a nickel compound, such that particles of the nickel or nickel compound from the grinding disk are embedded in the ground silicon carbide surface, and hardening the ground silicon carbide surface with the aid of a laser, such that at least some of the embedded nickel particles form a nickel silicide with silicon from the silicon carbide.