SiC Die Package with Ball-Isolated Wire Clamping
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Solution Overview
Problem
Existing die packages are limited in providing multiple wire connections and are not suitable for lightweight, robust designs, especially for high-temperature and high-vibration environments such as space travel, where they need to be both thermally stable and capable of handling physical forces.
Innovation Solution
A Multiwire Plate-Enclosed Ball-Isolated Single-Substrate Silicon-Carbide-Die Package design utilizing a plate clamp enclosed, ball isolated structure with a wiring board captured between an enclosure top and bottom plate, featuring adjustable clamping pressure extensions, silicon nitride isolation balls, and ceramic insulating guidance housings to provide electrical and physical clamping forces, ensuring reliable connections in harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing die package designs are used, then the package structure is simple, but the package cannot provide multiple wire connections and is not suitable for high-temperature and high-vibration environments
Solution Approach 1:
The package is divided into multiple functional segments: a substrate for mounting the silicon carbide die, an enclosure with top and bottom plates for mechanical protection, isolation balls for electrical insulation, and multiple wire connections for signal transmission. This segmentation allows each component to be optimized for its specific function while collectively providing robust environmental survival capability.
Solution Approach 2:
The package employs composite material structures including silicon carbide die mounted on a substrate, combined with ceramic or plastic enclosure materials. The use of silicon nitride isolation balls and metal wires creates a multi-material system that provides both mechanical strength and electrical insulation properties necessary for high-temperature and high-vibration environments.
2Reliability
If a robust package design is implemented for high-temperature and high-vibration environments, then environmental survival capability is improved, but the package weight increases
Solution Approach 1:
The enclosure provides robust mechanical protection and thermal stability only where needed - specifically at the substrate-die interface and wire connection points. The isolation balls provide localized electrical insulation where wires contact the substrate. This localized approach to reinforcement avoids unnecessary weight addition in non-critical areas while maintaining environmental survival capability.
3Productivity
If multiple wire connections are provided to multiple die, then input/output pin density is increased, but the package complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for mounting multiple silicon carbide die, acts as an electrical connection platform through deposited conductive patterns, provides thermal management pathways, and serves as the mounting surface for the enclosure. This multi-functionality allows multiple wire connections to be achieved without proportionally increasing overall package complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, lightweight, and high-density package with increased input/output pins, capable of surviving extreme temperatures and physical forces, while maintaining electrical and physical stability, thus addressing the limitations of previous designs.
Implementation Method 1
a ball isolated structure with a wiring board captured between an enclosure top and bottom plate... silicon nitride isolation balls... to provide electrical and physical clamping forces
Implementation Method 2
The adjustable clamping pressure extension includes a lower pressure end in a vertical arrangement with an isolation ball contacting the pressure end and a clamp disc contacting the isolation ball opposite the pressure end and above the wire contact pad to provide electrical and physical clamping forces to the wire end clamped between the clamp disc and the wire contact pad
Implementation Method 3
A cylindrical insulating guidance housing positioned above the wire contact pad uses an outer housing wall defining a vertical through aperture to accept and retain the pressure end, isolation ball, and clamp disc
Data Source
AI summary
A silicon carbide die package with multiple wire access points utilizing top and bottom enclosure plate clamps housing a silicon carbide die on a printed wiring board with wire contact pads, and a set of set screws providing downward pressure from the top enclosure plate inside the center of a cylindrical isolation housing to an isolation ball positioned above a clamp discs to clamp a wire end between the clamp disc and the wire contact pad.