SiC Power Module Baseplate Thermal Management
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Solution Overview
Problem
Conventional power converter modules using silicon switching components are limited by low switching frequency, leading to large filtering components, high costs, and low power density, with design principles focusing on reducing additional components to compensate, resulting in sub-optimal performance and cost.
Innovation Solution
Incorporating a baseplate and an active metal braze substrate with an aluminum nitride base layer in silicon carbide-based power converter modules, which improves thermal performance, allowing for smaller silicon carbide switching components while maintaining or increasing power ratings without increasing size, thus reducing overall costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional silicon switching components are used in power converter modules, then the modules can be manufactured with lower cost components, but the switching frequency is limited and filtering components must be large
Solution Approach 1:
The patent changes the material parameter from silicon to silicon carbide (SiC), which fundamentally alters the switching frequency capability. SiC components enable switching frequencies above 100 kHz compared to silicon's limitation below 50 kHz, while the patent addresses the cost concern through optimized module design that reduces overall manufacturing costs despite higher component costs
Solution Approach 2:
The patent employs composite material strategy by combining SiC switching components with advanced ceramic substrates and aluminum baseplates. This composite approach leverages the high-frequency capabilities of SiC while using materials with superior thermal and electrical properties to optimize overall module performance and manage heat dissipation effectively
2Temperature
If additional components such as baseplates and substrates are included in silicon-based power converter modules, then thermal performance is improved, but the overall cost of the module increases significantly
Solution Approach 1:
The patent changes the cost parameter perspective by recognizing that SiC's superior efficiency generates less heat, reducing the thermal management burden. This allows for optimized baseplate and substrate designs that provide adequate thermal performance without requiring oversized components, thereby controlling overall module cost while improving thermal characteristics
Solution Approach 2:
The patent applies partial thermal management by using thinner and more efficiently designed baseplates and substrates compared to silicon-based modules. Since SiC generates less heat and handles it more efficiently, full thermal management coverage is unnecessary, allowing cost reduction in these auxiliary components while maintaining adequate thermal performance
3Temperature
If the size of silicon switching components is increased to compensate for loss in thermal performance, then heat dissipation is improved, but the power density of the module decreases
Solution Approach 1:
The patent changes the material parameter to SiC, which has superior thermal conductivity and efficiency characteristics. This allows for smaller component sizes while maintaining or improving heat dissipation performance, directly resolving the contradiction between heat dissipation capability and power density by enabling higher power output from smaller footprints
4Ease of manufacture
If silicon carbide switching components are used with footprint less than 25 cm2, then cost is reduced and power density increases, but thermal performance may be compromised
Solution Approach 1:
The patent changes the thermal management approach by leveraging SiC's inherent efficiency and lower heat generation. This allows for compact baseplate and substrate designs that provide sufficient thermal performance for small-footprint modules without requiring the same level of thermal management infrastructure as larger silicon-based modules, thereby maintaining cost effectiveness and power density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size and cost of silicon carbide switching components, enhances thermal performance, and increases power ratings, achieving a better cost-performance ratio by using a baseplate and advanced substrate materials in power converter modules.
Implementation Method 1
an active metal braze substrate with an aluminum nitride base layer in silicon carbide-based power converter modules, which improves thermal performance
Data Source
AI summary
A power converter module includes a baseplate, a substrate on the baseplate, one or more silicon carbide switching components on the substrate, and a housing over the baseplate, the substrate, and the one or more silicon carbide switching components. The housing has a footprint less than 25 cm.sup.2. Including a baseplate in a power converter module with a footprint less than 25 cm.sup.2 runs counter to accepted design principles for silicon and silicon carbide-based power converter modules, but may improve performance of the power converter module and/or decrease the cost of the power converter module.