SiC Power Module Switching Loss Reduction

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Solution Overview

Problem

Conventional power devices, particularly those using silicon, face limitations in switching speed and efficiency when handling high voltages and frequencies due to their bipolar structure, which results in significant switching losses and unsuitability for high voltage and high frequency applications.

Innovation Solution

The use of silicon carbide (SiC) based unipolar power modules with switch modules comprising transistors and diodes, where the switch modules are interconnected to reduce switching losses and improve performance by utilizing a housing with specific output contact arrangements to minimize leakage inductance and employing conductive traces for reliable gate connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a bipolar structure (IGBT) is used to block high voltages, then the resistance of the drift layer decreases due to conductivity modulation, but the switching time becomes relatively slow due to reverse recovery time

Engineering Contradiction:
Improvevoltage blocking capabilityVSAvoidswitching speed
Core Design Contradiction:
StrengthVSSpeed

Solution Approach 1:

The patent transitions from silicon-based bipolar structures to silicon carbide-based unipolar structures, fundamentally changing the material parameter (bandgap, critical field) to enable both high voltage blocking and fast switching performance simultaneously

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent inverts the conventional approach by using unipolar devices instead of bipolar devices for high voltage applications, eliminating the reverse recovery time limitation inherent in bipolar structures while maintaining voltage blocking capability through SiC's superior material properties

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of manufacture

If conventional silicon power devices are used, then manufacturing and operation are simpler, but switching losses are significant and efficiency is reduced

Engineering Contradiction:
Improvedevice fabrication simplicityVSAvoidswitching loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent changes the material parameter from silicon to silicon carbide, which has superior electrical properties including higher critical field and wider bandgap, enabling low switching loss performance while maintaining manufacturability through established SiC fabrication processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs silicon carbide composite structures combining unipolar transistors and diodes in integrated modules, achieving low switching losses through the inherent properties of SiC materials while maintaining ease of manufacture through modular assembly

Inventive Principle:
Principle #40Composite materials

3Speed

If unipolar SiC power devices are used to block high voltages, then reverse recovery time is eliminated and switching speed increases, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveswitching speedVSAvoiddevice structure complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent divides the power conversion function into separate unipolar transistor and diode modules, each optimized for specific functions (switching and rectification), simplifying the overall device structure while maintaining high switching speed performance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates universal SiC power modules that can be configured in various topologies (bridge circuits, half-bridge, full-bridge) to meet different application requirements, reducing overall system complexity through component standardization

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10141302B2High current, low switching loss SiC power module
Publication Date: 2018.11.27 WOLFSPEED INC
  • US10141302B2 patent drawing
  • US10141302B2 patent drawing
  • US10141302B2 patent drawing

AI summary

A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.